公开(公告)号：US20110096265A1

公开(公告)日：2011-04-28

申请号：US12825603

申请日：2010-06-29

申请人： Kenichi MURAKOSHI ,  Yasuaki HIRANO ,  Nobuo OGATA ,  Shinji SUMINOE ,  Mitsuru HINENO ,  Yoshihisa SEKIGUCHI ,  Takafumi OHATA ,  Makoto HIROTA

发明人： Kenichi MURAKOSHI ,  Yasuaki HIRANO ,  Nobuo OGATA ,  Shinji SUMINOE ,  Mitsuru HINENO ,  Yoshihisa SEKIGUCHI ,  Takafumi OHATA ,  Makoto HIROTA

IPC分类号： G02F1/13357

CPC分类号： G02F1/133603 ,  G02F1/133605 ,  G02F2001/133607

摘要： Provided is a backlight unit capable of increasing luminance and of reducing unevenness in luminance. The backlight unit includes: a light diffusing member provided to cover a light emitting element mounted on a surface of a substrate; and a first light reflective member having a hole portion opened larger in size than an outer shape of the light diffusing member, the first light reflective member being provided on the surface of the substrate while having the light diffusing member protrude from the hole portion. In addition, a second light reflective member is further provided on the surface of the substrate, and the second light reflective member covers at least a part of a region corresponding to a gap left between the light diffusing member and the hole portion of the first light reflective member.

摘要翻译： 提供了能够提高亮度并减少亮度不均匀性的背光单元。 背光单元包括：光扩散构件，被设置为覆盖安装在基板的表面上的发光元件; 以及第一光反射构件，其具有比所述光漫射构件的外形大的开口部的孔部，所述第一光反射构件设置在所述基板的表面上，同时所述光漫射构件从所述孔部突出。 此外，在基板的表面上还设置有第二光反射部件，第二光反射部件覆盖与光扩散部件之间的间隙对应的区域的至少一部分，第一光 反光构件。

公开(公告)号：US20090001404A1

公开(公告)日：2009-01-01

申请号：US12113326

申请日：2008-05-01

申请人： Takafumi OHATA

发明人： Takafumi OHATA

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention provides a semiconductor light emitting device comprising: a wiring substrate in which a pair of positive and negative electrodes are formed on a front surface of an insulating substrate, an LED arranged over one of the electrodes, or arranged to stretch over both of the electrodes and connected electrically to the positive and negative electrode pair, and a metal frame having, at the inner circumferential side thereof, a tapered face and arranged around the electrode pair on the front surface of wiring substrate, wherein the metal frame is jointed to the front surface of the wiring substrate through an adhesive layer, and a plating layer is formed on a surface of the metal frame and surfaces of the electrode pair.

摘要翻译： 本发明提供一种半导体发光器件，包括：布线基板，其中一对正极和负极形成在绝缘基板的前表面上，LED布置在电极之一上，或布置成在两个 电极并与正极对和负极对电连接，金属框架在其内周侧具有锥形面，并且布置在布线基板的前表面上的电极对周围，其中金属框架连接到 通过粘合层形成布线基板的前表面，并且在金属框架的表面和电极对的表面上形成镀层。