公开(公告)号：US20110290769A1

公开(公告)日：2011-12-01

申请号：US13113379

申请日：2011-05-23

申请人： Kenji FURUTA ,  Satoshi USUDA

发明人： Kenji FURUTA ,  Satoshi USUDA

IPC分类号： B23K26/00

CPC分类号： B23K26/046 ,  B23K26/03 ,  B23K26/40 ,  B23K2103/50

摘要： A workpiece including an irregularly shaped portion on a dividing line is divided along the dividing line by detecting the location of the irregularly shaped portion, applying a detecting laser beam to an area of the workpiece except for the detected location, along the dividing line to detect the height of a surface of the workpiece except for the location, applying and focusing a machining laser beam having a wavelength which permeates the workpiece within the workpiece while moving a focused spot of the machining laser beam based on the detected height of the surface of the workpiece to form a modified layer in an area of the workpiece except for at least the location of the irregularly shaped portion along the dividing line, and applying an external force to the modified layer to divide the workpiece along the dividing line.

摘要翻译： 通过检测不规则形状部分的位置，沿着分割线将除了检测位置的检测激光束施加到工件的区域上，沿分割线分割包括分割线上的不规则形状部分的工件，以检测 除了所述位置之外，所述工件的表面的高度，在基于检测到的所述表面的高度移动所述加工激光束的聚焦点的同时，将具有在工件内渗透的波长的加工激光束施加和聚焦 工件，除了至少沿着分割线的不规则形状部分的位置之外，在工件的区域中形成改性层，并且向改性层施加外力以沿着分割线分割工件。