公开(公告)号：US12083621B2

公开(公告)日：2024-09-10

申请号：US17274695

申请日：2019-09-03

Applicant: JENOPTIK Optical Systems GmbH

Inventor： Jan Werschnik ,  Stefan Franz ,  Achmed Esselbach

IPC: B23K26/06 ,  B23K26/046 ,  G02B7/08 ,  G02B15/14 ,  G02B19/00 ,  G02B27/09

CPC classification number: B23K26/0648 ,  B23K26/046 ,  G02B7/08 ,  G02B15/14 ,  G02B19/0014 ,  G02B19/0047 ,  G02B27/0955

Abstract: An apparatus (112) for focus adjustment for a device (100) for laser material processing, which has a movably arranged first lens unit (124), which comprises a first lens (108), and a movably arranged second lens unit (126), which comprises a second lens (110), has an adjustment device (114) which is designed to move the first lens unit (124) in a first direction (116) and to move the second lens unit (126) in a second direction (118) opposite to the first direction (116) in order to adjust a distance between the first lens (108) and the second lens (110) for the focus adjustment.

公开(公告)号：US11980971B2

公开(公告)日：2024-05-14

申请号：US17132987

申请日：2020-12-23

Applicant: Via Mechanics, Ltd.

Inventor： Yuki Saeki

IPC: B23K26/382 ,  B23K26/00 ,  B23K26/04 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/082

CPC classification number: B23K26/382 ,  B23K26/0006 ,  B23K26/043 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/082

Abstract: A purpose of the present invention is to quickly change a focal point of a laser emission system so that processing with high quality and good processing efficiency can be performed. In a laser processing apparatus including: a laser oscillator configured to output a laser pulse; a laser deflector configured to deflect the laser pulse in a two-dimensional direction; and a controller configured to control the laser oscillator and the laser deflector, the laser processing apparatus being configured to emit the laser pulse to a workpiece for processing the workpiece, the laser processing apparatus has a feature in which an electrooptic device capable of, under control of the controller, electrically changing a focal point of the laser pulse to be input to the laser deflector is arranged in an input side of the laser deflector.

公开(公告)号：US20240117543A1

公开(公告)日：2024-04-11

申请号：US18222017

申请日：2023-07-14

Applicant: TONELLO S.r.l.

Inventor： Flavio TONELLO

IPC: D06C23/02 ,  B23K26/046 ,  B23K26/06 ,  B23K26/16 ,  B23K26/402

CPC classification number: D06C23/02 ,  B23K26/046 ,  B23K26/0626 ,  B23K26/0648 ,  B23K26/16 ,  B23K26/402 ,  B23K2103/38

Abstract: The present invention relates to a machine for the treatment of products, in particular textile products, such as clothing, particularly suitable for being used for the application of engravings or decorative elements or motifs.
Furthermore, the present invention also relates to a method for the treatment of products, in particular textile products, such as clothing, by means of the aforementioned machine.

公开(公告)号：US20240042546A1

公开(公告)日：2024-02-08

申请号：US18377394

申请日：2023-10-06

Applicant: Mitsubishi Electric Corporation ,  TADA ELECTRIC CO., LTD.

Inventor： Kazuki KUBA ,  Akihiro UENO ,  Toshinobu EGUCHI ,  Masaru YOSHIDA ,  Junji MIYATA

IPC: B23K26/06 ,  B23K26/046 ,  B23K26/073 ,  G02B27/09

CPC classification number: B23K26/0648 ,  B23K26/046 ,  B23K26/0643 ,  B23K26/073 ,  G02B27/0927 ,  B23K26/0665

Abstract: A laser processing machine to perform laser processing by focusing a laser beam onto a workpiece, includes a light-focusing optical system to focus the laser beam, wherein the light-focusing optical system has an aberration, and a lateral aberration with respect to a laser beam diameter:D86.5 containing 86.5% of the laser power of a laser beam before being focused is 0.2 mm or more, the lateral aberration being at a light focusing point relative to a light beam corresponding to the laser beam diameter:D86.5.

公开(公告)号：US20240001485A1

公开(公告)日：2024-01-04

申请号：US18039570

申请日：2021-07-27

Applicant: MAXONE SEMICONDUCTOR CO., LTD.

Inventor： Haichao YU ,  Ming ZHOU

IPC: B23K26/046 ,  B23K26/06 ,  B23K26/362 ,  B23K26/08

CPC classification number: B23K26/046 ,  B23K26/0648 ,  B23K26/362 ,  B23K26/0861 ,  G01R1/06744

Abstract: A laser etching method for MEMS probes belongs to the technical field of semiconductor processing and testing; first, the MEMS probe laser etching method performs the parameter calculation to obtain the step angle of the motor according to the etching spacing of the single crystal silicon wafer; then it performs the initial position adjustment to rotate the spiral through-groove plate to the initial position and move the first etching point to the optical axis, and adjust the four-dimensional stage; and then it performs the laser etching and progress judgment; and finally adjusts the four-dimensional stage and the motor, including the downward movement distance, left movement distance and clockwise rotation angle of the four-dimensional stage and the rotation angle of the motor; the MEMS probe laser etching method, combined with the MEMS probe laser etching device, not only has higher etching accuracy, but also continuously adjusts the etching spacing.

公开(公告)号：US11833760B2

公开(公告)日：2023-12-05

申请号：US18109529

申请日：2023-02-14

Applicant: Xiamen University

Inventor： Wei Zhou ,  Rui Chen ,  Xinning Zhu ,  Tao Luo ,  Weisong Ling ,  Chiqian Xiao

IPC: B29C64/386 ,  B23K26/046 ,  B33Y50/02 ,  B23K26/359 ,  B23K37/04

CPC classification number: B29C64/386 ,  B23K26/046 ,  B23K26/359 ,  B23K37/0417 ,  B33Y50/02

Abstract: A laser conformal manufacturing method of a flexible sensor comprises: obtaining morphology data of a curved surface, and constructing a Standard Triangle Language (STL) model of the curved surface; introducing into a 3D modeling software, and combining the curved surface with a clamper holder; manufacturing to obtain the clamper with the curved surface; coating material to be manufactured on a 3D curved surface of the clamper with the curved surface; positioning to a processing platform of a laser device; constructing a model of a pattern to be manufactured by laser based on the STL model of the curved surface, and constructing an STL model or a dwg model of the pattern to be manufactured; introducing into the laser device, turning on the laser device, and running a 3D dynamic focus system; repeating the steps 4-8, and stripping the flexible sensor from the 3D curved surface.

公开(公告)号：US11801570B2

公开(公告)日：2023-10-31

申请号：US17100022

申请日：2020-11-20

Applicant: MITUTOYO CORPORATION

Inventor： Koji Kubo

IPC: B23K26/06 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/03 ,  B23K26/046

CPC classification number: B23K26/0648 ,  B23K26/032 ,  B23K26/046 ,  B23K26/066 ,  B23K26/0622

Abstract: A laser processing machine includes: a variable focal length optical system in which a focus position is periodically changed in response to a drive signal to be inputted; a position-detection light source configured to emit a detection light onto a workpiece through the variable focal length optical system; a light detector configured to receive the detection light reflected on the workpiece and output a light detection signal; a signal processor configured to output a synchronization pulse signal in synchronization with the focus timing when the detection light is focused on the surface of the workpiece in accordance with the inputted light detection signal; and a laser oscillator configured to oscillate a pulse laser beam in accordance with the inputted synchronization pulse signal to radiate the pulse laser beam on the workpiece through the variable focal length optical system.

公开(公告)号：US11766740B2

公开(公告)日：2023-09-26

申请号：US16979098

申请日：2019-02-20

Applicant: Precitec GmbH & Co. KG

Inventor： David Blazquez Sanchez

IPC: B23K26/046 ,  B23K26/08 ,  B23K26/064 ,  B23K26/34

CPC classification number: B23K26/046 ,  B23K26/064 ,  B23K26/0869 ,  B23K26/34

Abstract: A device for determining a focus position of a laser beam in a laser machining system has a first optical element which is designed to reflect a portion of the laser beam in order to uncouple a first sub-beam of the laser beam, a second optical element which is designed to reflect another portion of the laser beam in order to uncouple a second sub-beam of the laser beam substantially coaxially to the first sub-beam, a spatially-resolving sensor to which the first sub-beam and the second sub-beam can be directed, and an evaluation unit which is designed to determine a focus position of the laser beam on the basis of the first and second sub-beams hitting the spatially-resolving sensor.

公开(公告)号：US20230219164A1

公开(公告)日：2023-07-13

申请号：US18149243

申请日：2023-01-03

Applicant: DISCO CORPORATION

Inventor： Taizo KISE ,  Shogo MATSUDA ,  Taiki SAWABE ,  Nobumori OGOSHI

IPC: B23K26/03 ,  B23K26/046 ,  B23K26/08

CPC classification number: B23K26/032 ,  B23K26/046 ,  B23K26/0853

Abstract: A laser processing apparatus includes a laser beam applying unit for applying a laser beam to a wafer. The laser beam applying unit includes a laser oscillator for emitting the laser beam, a beam condenser for focusing the laser beam emitted from the laser oscillator into a focused spot and positioning the focused spot in the wafer held on a chuck table, a focused spot position adjuster disposed between the laser oscillator and the beam condenser for adjusting the position of the focused spot, and an upper surface position detector for detecting the position of an upper surface of the wafer. The upper surface position detector includes a first upper surface position detecting unit, a second upper surface position detecting unit, and a selector for selecting either the first upper surface position detecting unit or the second upper surface position detecting unit depending on a feature of the wafer.

公开(公告)号：US20230202113A1

公开(公告)日：2023-06-29

申请号：US18109529

申请日：2023-02-14

Applicant: Xiamen University

Inventor： Wei ZHOU ,  Rui Chen ,  Xinning Zhu ,  Tao LUO ,  Weisong LING ,  Chiqian XIAO

IPC: B29C64/386 ,  B23K26/046 ,  B23K37/04 ,  B23K26/359 ,  B33Y50/02

CPC classification number: B29C64/386 ,  B23K26/046 ,  B23K37/0417 ,  B23K26/359 ,  B33Y50/02

Abstract: A laser conformal manufacturing method of a flexible sensor comprises: obtaining morphology data of a curved surface, and constructing a Standard Triangle Language (STL) model of the curved surface; introducing into a 3D modeling software, and combining the curved surface with a clamper holder; manufacturing to obtain the clamper with the curved surface; coating material to be manufactured on a 3D curved surface of the damper with the curved surface; positioning to a processing platform of a laser device; constructing a model of a pattern to be manufactured by laser based on the STL model of the curved surface, and constructing an STL model or a dwg model of the pattern to be manufactured; introducing into the laser device, turning on the laser device, and running a 3D dynamic focus system; repeating the steps 4-8, and stripping the flexible sensor from the 3D curved surface.