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    Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier
    1.
    发明授权
    Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier 失效
    化学机械抛光系统具有双材料晶片背衬膜和两片晶片载体

    公开(公告)号：US06171513B2

    公开(公告)日：2001-01-09

    申请号：US09303471

    申请日：1999-04-30

    申请人： Kenneth Morgan Davis ,  Ralph R. Comulada, Jr. ,  Fen Fen Jamin ,  Bradley Paul Jones ,  Francis R. Krug ,  Michael Francis Lofaro

    发明人： Kenneth Morgan Davis ,  Ralph R. Comulada, Jr. ,  Fen Fen Jamin ,  Bradley Paul Jones ,  Francis R. Krug ,  Michael Francis Lofaro

    IPC分类号： B24B100

    CPC分类号： B24B37/30

    摘要： A system for chemical-mechanical polishing is described which includes a wafer backing film having concentric first and second portions, and a wafer carrier having corresponding first and second portions for mounting the portions of the wafer backing film thereon. The portions of the wafer backing film are of different materials. The second portion of the wafer backing film has an annular shape and surrounds the first portion; the second portion of the wafer carrier is adjustable with respect to the first portion of the wafer carrier in a vertical direction. The second portion of the wafer backing film is less compressible than the first portion, and is adjusted in the vertical direction so that the outer edge of the wafer is substantially sealed when backside air is applied to the wafer during a film removal process.

    摘要翻译： 描述了一种用于化学机械抛光的系统，其包括具有同心的第一和第二部分的晶片背衬膜，以及具有相应的第一和第二部分的晶片载体，用于将晶片背衬膜的部分安装在其上。 晶片背衬膜的部分是不同的材料。 晶片背衬膜的第二部分具有环形形状并围绕第一部分; 晶片载体的第二部分在垂直方向上相对于晶片载体的第一部分是可调节的。 晶片背衬膜的第二部分比第一部分可压缩性低，并且在垂直方向上被调节，使得当在膜去除过程中将背面空气施加到晶片时，晶片的外边缘基本上被密封。

    Chemical-mechanical polishing system having a bi-material wafer backing film assembly
    2.
    发明授权
    Chemical-mechanical polishing system having a bi-material wafer backing film assembly 失效
    具有双材料晶片背衬膜组件的化学机械抛光系统

    公开(公告)号：US06344414B1

    公开(公告)日：2002-02-05

    申请号：US09303470

    申请日：1999-04-30

    申请人： Kenneth Morgan Davis ,  Fen Fen Jamin ,  Bradley Paul Jones ,  Michael Francis Lofaro

    发明人： Kenneth Morgan Davis ,  Fen Fen Jamin ,  Bradley Paul Jones ,  Michael Francis Lofaro

    IPC分类号： H01L21302

    CPC分类号： B24B37/30

    摘要： A system for chemical-mechanical polishing is described which includes a wafer backing film having concentric first and second portions. The portions of the wafer backing film are of different materials. The second portion of the wafer backing film has an annular shape and surrounds the first portion; a backing shim is used to adjust the first portion and second portion with respect to each other in a vertical direction. The first and second portions of the wafer backing film and the backing shim are mounted on an adhesive assembly film, thereby forming an assembly for mounting on a wafer carrier. The second portion of the wafer backing film is less compressible than the first portion, and is adjusted in the vertical direction so that the outer edge of the wafer is substantially sealed when backside air is applied to the wafer during a film removal process.

    摘要翻译： 描述了一种用于化学机械抛光的系统，其包括具有同心的第一和第二部分的晶片背衬膜。 晶片背衬膜的部分是不同的材料。 晶片背衬膜的第二部分具有环形形状并围绕第一部分; 背衬垫片用于在垂直方向上相对于彼此调节第一部分和第二部分。 晶片背衬膜和背衬垫片的第一和第二部分安装在粘合剂组合膜上，从而形成用于安装在晶片载体上的组件。 晶片背衬膜的第二部分比第一部分可压缩性低，并且在垂直方向上被调节，使得当在膜去除过程中将背面空气施加到晶片时，晶片的外边缘基本上被密封。