公开(公告)号：US20070056683A1

公开(公告)日：2007-03-15

申请号：US11517576

申请日：2006-09-08

Applicant: Kevin Manes ,  John Howard

Inventor： Kevin Manes ,  John Howard

IPC: B32B37/00

CPC classification number: G06K19/077 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/0775 ,  Y10T156/1075

Abstract: An apparatus and a method are disclosed for forming an electrical component construction, the method comprising: obtaining a chip webstock containing a plurality of integrated circuit chips; obtaining a label webstock having printed label graphics thereon; cutting the chip webstock into a plurality of chip sections, each of the chip sections including at least one integrated circuit chip; indexing the chip sections from a high density on the chip webstock to a lower density; attaching each of a plurality of the different chip sections on a different label on the label webstock; obtaining an electrical component webstock comprising electrical components on a web; and attaching each of a plurality of the electrical components relative to a different one of the integrated circuit chips on the label webstock to permit an electrical communication therebetween.

Abstract translation: 公开了用于形成电气部件结构的装置和方法，该方法包括：获得包含多个集成电路芯片的芯片卷筒纸; 获得其上具有打印标签图形的标签webstock; 将所述芯片卷筒纸切割成多个芯片部分，每个芯片部分包括至少一个集成电路芯片; 将芯片部分从芯片上的高密度索引到较低的密度; 将多个不同芯片部分中的每一个附接在标签网卷筒上的不同标签上; 获得包括网上的电气部件的电气部件腹板; 并且将多个电气部件中的每一个相对于所述标签卷筒纸上的所述集成电路芯片中的不同的一个连接以允许其间的电连通。

公开(公告)号：US20060238989A1

公开(公告)日：2006-10-26

申请号：US11113319

申请日：2005-04-25

Applicant: Kevin Manes ,  Gregory Wells ,  David Kuhn ,  Martin Ross

Inventor： Kevin Manes ,  Gregory Wells ,  David Kuhn ,  Martin Ross

IPC: H05K7/06

CPC classification number: G06K19/07749

Abstract: A method and apparatus for bonding an RFID strap to a substrate, one embodiment of the method comprising: applying a bonding tape with an adhesive on at least one side to an RFID strap so that the RFID strap is mechanically bonded to the bonding tape to result in a laminated bonding tape and RFID strap, wherein the strap includes an electrical chip and strap leads, and wherein the strap does not include an antenna; cutting the laminated bonding tape and RFID strap into a piece so that the bonding tape extends beyond opposite ends of the RFID strap for the piece; and mechanically bonding the bonding tape of the piece to the substrate in an orientation so that the RFID strap leads on the piece electrically couple to an antenna.

Abstract translation: 一种用于将RFID带绑定到基底的方法和装置，所述方法的一个实施例包括：在至少一个侧面上用粘合剂将粘结带施加到RFID带，使得RFID带被机械地结合到粘合带上以产生 在层压粘合带和RFID带中，其中所述带包括电芯片和带引线，并且其中所述带不包括天线; 将层压粘合带和RFID带切割成片，使得粘合带延伸超过用于片的RFID带的相对端; 并且将该片的粘合带以取向方式机械地粘合到基底上，使得RFID带在该片上引导电耦合到天线。