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    INTERNAL VOLTAGE GENERATION CIRCUIT OF SMART CARD AND SMART CARD INCLUDING THE SAME
    1.
    发明公开
    INTERNAL VOLTAGE GENERATION CIRCUIT OF SMART CARD AND SMART CARD INCLUDING THE SAME 审中-公开

    公开(公告)号：US20240232564A9

    公开(公告)日：2024-07-11

    申请号：US18396071

    申请日：2023-12-26

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Eunsang Jang ,  Junho Kim ,  Inhyuk Kim

    IPC: G06K19/07 ,  G06K19/077 ,  H02M3/335

    CPC classification number: G06K19/0718 ,  G06K19/0715 ,  G06K19/0723 ,  G06K19/077 ,  H02M3/33507 ,  H02M3/33584

    Abstract: An internal voltage generation circuit of a smart card to perform fingerprint authentication and a smart card includes a first contact switch, a second contact switch, a switched capacitor converter and a bidirectional switched capacitor converter. The first contact switch selectively switches a contact voltage to a first node based on a first switching enable signal, in a contact mode. The second contact switch selectively switches the contact voltage to a second node based on a second switching enable signal, in the contact mode. The bidirectional switched capacitor converter steps down a first driving voltage of the first node to provide a second voltage to the second node in the contactless mode and either steps down the first driving voltage or boosts a second driving voltage of the second node based on a level of the contact voltage to provide a boosted voltage to the first node in the contact mode.

    ACCESSIBLE CARD WITH IDENTIFICATION EMBOSSING
    2.
    发明公开
    ACCESSIBLE CARD WITH IDENTIFICATION EMBOSSING 审中-公开

    公开(公告)号：US20240193395A1

    公开(公告)日：2024-06-13

    申请号：US18063132

    申请日：2022-12-08

    Applicant: Truist Bank

    Inventor： Hyekyeng Lyn Kim ,  Crarlos Lomena

    IPC: G06K19/077

    CPC classification number: G06K19/077

    Abstract: An accessible card can provide access to an account. The account card can include sides and an identification embossing for providing access to an account. The sides can be be connected to form a shape. The identification embossing can be associated with at least one side of the sides. The at least one side associated with the identification embossing can include a first thickness and an arrangement of one or more tactile features. The first thickness can be different than a second thickness associated with other sides of the sides. The arrangement may indicate, via tactile interaction, an identification of the account associated with the account card or a card type of the account card.

    Wireless communication device
    3.
    发明授权
    Wireless communication device 有权

    公开(公告)号：US11973281B2

    公开(公告)日：2024-04-30

    申请号：US17097637

    申请日：2020-11-13

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Hirokazu Yazaki

    IPC: G06K19/07 ,  G06K19/077 ,  G08B13/24 ,  H01Q1/00 ,  H01Q1/38 ,  H01Q9/26 ,  H04W4/80

    CPC classification number: H01Q9/26 ,  G06K19/077 ,  H01Q1/002 ,  H01Q1/38

    Abstract: An RFID tag is provided that transmits and receives a communication signal. The RFID tag includes a base material, an antenna pattern provided on the base material, and an expansion member. The expansion member is disposed adjacent to the antenna pattern and has a coefficient of linear expansion that is higher than coefficients of linear expansion of the antenna pattern. When the RFID tag is subjected to an electromagnetic wave heating microwave, and thus the temperature of each portion rises, the antenna pattern breaks at a position of the expansion member. With this configuration, ignition and combustion are able to be prevented even in a situation in which the RFID tag is subjected to high-frequency power for heating a food item while being attached to the food item.

    CONTAINER INCLUDING RFID MODULE
    5.
    发明公开
    CONTAINER INCLUDING RFID MODULE 审中-公开

    公开(公告)号：US20230359847A1

    公开(公告)日：2023-11-09

    申请号：US18355868

    申请日：2023-07-20

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Noboru KATO

    IPC: G06K19/02 ,  G06K19/077 ,  G06K19/07 ,  H01Q1/22 ,  H01Q1/38

    CPC classification number: G06K19/025 ,  G06K19/077 ,  G06K19/0723 ,  H01Q1/2208 ,  H01Q1/38

    Abstract: A container is provided includes a base material having insulating properties that form an outer shape, a metal film on the base material, and a first slit in the metal film. The base material includes a first surface, a second surface, and a first flap continuous with the first surface. The first slit separates the metal film on the first flap into first and second metal regions. An RFID module includes an RFIC element, a filter circuit, and first and second electrodes connected to the filter circuit. The first electrode and the first metal region are electrically connected to each other. The second electrode and the second metal region are electrically connected to each other. The first metal region is continuous with the metal film on the first surface and the second metal region is capacitively coupled to the metal film on the second surface.

    WIRELESS COMMUNICATION DEVICE MANUFACTURING SYSTEM
    7.
    发明公开
    WIRELESS COMMUNICATION DEVICE MANUFACTURING SYSTEM 审中-公开

    公开(公告)号：US20230267297A1

    公开(公告)日：2023-08-24

    申请号：US18309117

    申请日：2023-04-28

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yoshinori YAMAWAKI ,  Noboru KATO ,  Ryosuke WASHIDA ,  Yoshiki ABURATANI

    IPC: G06K19/077 ,  H05K13/04 ,  H05K3/34

    CPC classification number: G06K19/077 ,  H05K13/04 ,  H05K3/341

    Abstract: A wireless communication device manufacturing system includes: a mounting apparatus including a mounting head mounted with a suction nozzle that sucks and holds an RFIC module including an RFIC chip, a terminal electrode, and a hot melt adhesive layer; a conveyance apparatus configured to convey the antenna base material including an antenna pattern to a mounting position; and a heating apparatus configured to heat the hot melt adhesive layer of the RFIC module. The wireless communication device manufacturing system bonds the RFIC module in a state where the hot melt adhesive layer is softened by heating of the heating apparatus to the antenna base material disposed at the mounting position through the hot melt adhesive layer, and capacitively couples the antenna pattern and the terminal electrode through the hot melt adhesive layer.

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