公开(公告)号：US08373427B2

公开(公告)日：2013-02-12

申请号：US12831855

申请日：2010-07-07

Applicant: Kezia Cheng

Inventor： Kezia Cheng

IPC: G01R27/08

CPC classification number: H01L22/14 ,  C23C14/30 ,  C23C14/548 ,  G01N27/00 ,  H01J37/304 ,  H01J37/3053 ,  H01J2237/24475 ,  H01J2237/30472 ,  H01J2237/3132 ,  H01L21/02 ,  Y10T29/41

Abstract: Disclosed herein are systems and methods for in-situ measurement of impurities on metal slugs utilized in electron-beam metal evaporation/deposition systems, and for increasing the production yield of a semiconductor manufacturing processes utilizing electron-beam metal evaporation/deposition systems. A voltage and/or a current level on an electrode disposed in a deposition chamber of an electron-beam metal evaporation/deposition system is monitored and used to measure contamination of the metal slug. Should the voltage or current reach a certain level, the deposition is completed and the system is inspected for contamination.

公开(公告)号：US20110193576A1

公开(公告)日：2011-08-11

申请号：US12831855

申请日：2010-07-07

Applicant: Kezia Cheng

Inventor： Kezia Cheng

IPC: G01R27/08

CPC classification number: H01L22/14 ,  C23C14/30 ,  C23C14/548 ,  G01N27/00 ,  H01J37/304 ,  H01J37/3053 ,  H01J2237/24475 ,  H01J2237/30472 ,  H01J2237/3132 ,  H01L21/02 ,  Y10T29/41

Abstract: Disclosed herein are systems and methods for in-situ measurement of impurities on metal slugs utilized in electron-beam metal evaporation/deposition systems, and for increasing the production yield of a semiconductor manufacturing processes utilizing electron-beam metal evaporation/deposition systems. A voltage and/or a current level on an electrode disposed in a deposition chamber of an electron-beam metal evaporation/deposition system is monitored and used to measure contamination of the metal slug. Should the voltage or current reach a certain level, to the deposition is completed and the system is inspected for contamination.

Abstract translation: 本文公开了用于在电子束金属蒸发/沉积系统中使用的金属块上的杂质的原位测量的系统和方法，以及利用电子束金属蒸发/沉积系统提高半导体制造工艺的生产产量。 监测设置在电子束金属蒸发/沉积系统的沉积室中的电极上的电压和/或电流水平，以用于测量金属屑的污染。 如果电压或电流达到一定水平，完成沉积并检查系统是否有污染。