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1.发明申请Manufacturing device of semiconductor package and manufacturing method of semiconductor package 失效半导体封装制造装置及半导体封装的制造方法公开(公告)号：US20080090313A1
公开(公告)日：2008-04-17
申请号：US11882136
申请日：2007-07-31
CPC分类号： H01L24/81 , H01L22/20 , H01L23/544 , H01L24/75 , H01L2223/54473 , H01L2224/13144 , H01L2224/16 , H01L2224/75 , H01L2224/75301 , H01L2224/81121 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83908 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/00014
摘要： A manufacturing device of a semiconductor package includes: a holding element for holding a substrate; a bonding element for holding the package and bonding a first metal bump of the package to a second metal bump of the substrate; a monitoring element for irradiating an infrared light toward the substrate and monitoring an electrode pad under the second metal bump based on a reflected light reflected on the pad; and a determination element for determining a state of a bonding surface between the first and second metal bumps based on monitoring information of the pad. The monitoring element faces the bonding element through the holding element, the substrate and the package.
摘要翻译： 半导体封装的制造装置包括：用于保持基板的保持元件; 用于保持封装并将封装的第一金属凸块接合到衬底的第二金属凸块的接合元件; 监测元件，用于向基板照射红外光，并且基于在所述焊盘上反射的反射光来监测所述第二金属凸块下方的电极焊盘; 以及确定元件，用于基于所述焊盘的监视信息来确定所述第一和第二金属凸块之间的接合表面的状态。 监测元件通过保持元件，基板和封装件面向结合元件。
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2.发明授权Manufacturing device of semiconductor package and manufacturing method of semiconductor package 失效半导体封装制造装置及半导体封装的制造方法公开(公告)号：US07659127B2
公开(公告)日：2010-02-09
申请号：US11882136
申请日：2007-07-31
IPC分类号： H01L21/00
CPC分类号： H01L24/81 , H01L22/20 , H01L23/544 , H01L24/75 , H01L2223/54473 , H01L2224/13144 , H01L2224/16 , H01L2224/75 , H01L2224/75301 , H01L2224/81121 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83908 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/00014
摘要： A manufacturing device of a semiconductor package includes: a holding element for holding a substrate; a bonding element for holding the package and bonding a first metal bump of the package to a second metal bump of the substrate; a monitoring element for irradiating an infrared light toward the substrate and monitoring an electrode pad under the second metal bump based on a reflected light reflected on the pad; and a determination element for determining a state of a bonding surface between the first and second metal bumps based on monitoring information of the pad. The monitoring element faces the bonding element through the holding element, the substrate and the package.
摘要翻译： 半导体封装的制造装置包括：用于保持基板的保持元件; 用于保持封装并将封装的第一金属凸块接合到衬底的第二金属凸块的接合元件; 监测元件，用于向基板照射红外光，并且基于在所述焊盘上反射的反射光来监测所述第二金属凸块下方的电极焊盘; 以及确定元件，用于基于所述焊盘的监视信息来确定所述第一和第二金属凸块之间的接合表面的状态。 监测元件通过保持元件，基板和封装件面向结合元件。
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公开(公告)号：US07772025B2
公开(公告)日：2010-08-10
申请号：US11902984
申请日：2007-09-27
申请人： Osamu Arao , Akira Shintai , Takashige Saitoh
发明人： Osamu Arao , Akira Shintai , Takashige Saitoh
IPC分类号： H01L21/00
CPC分类号： G01C19/56 , B81B2201/025 , B81B2201/0264 , B81C1/00333 , B81C2203/0136 , G01P1/023 , G01P15/0802 , G01P15/125 , H01L2224/0554 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , H01L2924/1305 , H01L2924/13091 , Y10T428/24355 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic device includes an electronic element having a detecting part on one surface thereof, a base member, bumps, and an adhesive film. The base member is arranged to face the one surface of the electric element. The bumps are arranged between the electric element and the base member for electrically coupling the electric element and the base member. The adhesive film is attached to the one surface of the electronic element and has an electronic insulating property. In addition, the adhesive film has a hollow part at a portion corresponding to the detecting part in a manner separated from the detecting part. Furthermore, a first pressure in the hollow part is higher than a second pressure outside the hollow part.
摘要翻译： 电子设备包括在其一个表面上具有检测部分的电子元件，基底构件，凸块和粘合剂膜。 基部构件被布置成面向电气元件的一个表面。 凸起布置在电气元件和基座构件之间，用于电连接电气元件和基座构件。 粘合膜附着在电子元件的一个表面上，具有电子绝缘性。 此外，粘合膜在与检测部分分离的方式在与检测部对应的部分处具有中空部。 此外，中空部分中的第一压力高于中空部分外部的第二压力。
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公开(公告)号：US20080081150A1
公开(公告)日：2008-04-03
申请号：US11902984
申请日：2007-09-27
申请人： Osamu Arao , Akira Shintai , Takashige Saitoh
发明人： Osamu Arao , Akira Shintai , Takashige Saitoh
IPC分类号： B32B3/26
CPC分类号： G01C19/56 , B81B2201/025 , B81B2201/0264 , B81C1/00333 , B81C2203/0136 , G01P1/023 , G01P15/0802 , G01P15/125 , H01L2224/0554 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , H01L2924/1305 , H01L2924/13091 , Y10T428/24355 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic device includes an electronic element having a detecting part on one surface thereof, a base member, bumps, and an adhesive film. The base member is arranged to face the one surface of the electric element. The bumps are arranged between the electric element and the base member for electrically coupling the electric element and the base member. The adhesive film is attached to the one surface of the electronic element and has an electronic insulating property. In addition, the adhesive film has a hollow part at a portion corresponding to the detecting part in a manner separated from the detecting part. Furthermore, a first pressure in the hollow part is higher than a second pressure outside the hollow part.
摘要翻译： 电子设备包括在其一个表面上具有检测部分的电子元件，基底构件，凸块和粘合剂膜。 基部构件被布置成面向电气元件的一个表面。 凸起布置在电气元件和基座构件之间，用于电连接电气元件和基座构件。 粘合膜附着在电子元件的一个表面上，具有电子绝缘性。 此外，粘合膜在与检测部分分离的方式在与检测部对应的部分处具有中空部。 此外，中空部分中的第一压力高于中空部分外部的第二压力。
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