MEMORY DEVICE
    1.
    发明公开
    MEMORY DEVICE 审中-公开

    公开(公告)号:US20240215459A1

    公开(公告)日:2024-06-27

    申请号:US18476628

    申请日:2023-09-28

    CPC classification number: H10N50/85 H10B61/00 H10N50/20

    Abstract: A memory device of embodiments includes a memory cell including: a first conductive layer; a second conductive layer; a third conductive layer provided between the first conductive layer and the second conductive layer; a variable resistance layer provided between the first conductive layer and the third conductive layer; and a switching layer provided between the third conductive layer and the second conductive layer. The switching layer contains an oxide of a first element, which is at least one element selected from a group consisting of zirconium, yttrium, tantalum, lanthanum, cerium, titanium, hafnium, and magnesium, and a compound of a second element that is at least one element selected from a group consisting of zinc, tin, gallium, indium, and bismuth and a third element that is at least one element selected from a group consisting of tellurium, sulfur, and selenium.

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