SUBSTRATE PROCESSING APPARATUS, METHOD FOR SUBSTRATE PROCESSING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20240429075A1

    公开(公告)日:2024-12-26

    申请号:US18740873

    申请日:2024-06-12

    Abstract: A substrate processing apparatus according to an embodiment includes a processing tank configured to store a chemical and perform processing by immersing a substrate in the chemical, a holder configured to hold the substrate and having a lifting part, a chemical liquid supply device configured to supply the chemical, a light irradiation part configured to irradiate light to the substrate taken out from the processing tank, the substrate being taken out from the processing tank by the lifting part after immersing the substrate in the chemical, a light detection part configured to detect reflected light generated from the light being reflected by the substrate, and a control device configured to control an amount of chemical supplied by the chemical liquid supply device in response to a detection result of the light detection part.

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