MEMORY DEVICE
    1.
    发明公开
    MEMORY DEVICE 审中-公开

    公开(公告)号:US20240324169A1

    公开(公告)日:2024-09-26

    申请号:US18601832

    申请日:2024-03-11

    Abstract: According to one embodiment, a memory device includes, a memory cell array including first to fourth sub-arrays, a first bit line coupled to the first sub-array and the second sub-array, a second bit line arranged side by side with the first bit line in a first direction and coupled to the third sub-array and the fourth sub-array, a third bit line arranged at a position different from the first bit line in a second direction and coupled to at least the second sub-array and the third sub-array, a fourth bit line arranged side by side with the third bit line in the first direction and coupled to the fourth sub-array, a first circuit electrically coupled to the first bit line and the second bit line, and a second circuit electrically coupled to the third bit line and the fourth bit line.

    SEMICONDUCTOR STORAGE DEVICE
    2.
    发明公开

    公开(公告)号:US20240282359A1

    公开(公告)日:2024-08-22

    申请号:US18582433

    申请日:2024-02-20

    CPC classification number: G11C11/4087 G11C11/4091 G11C11/4096

    Abstract: A memory includes a cell array including first and second sub arrays including memory cells and simultaneously driven in a read or a write operation. First lines are connected to the cells corresponding to one of physical rows, where the physical row is the cells arranged in a first direction in the cell array. Second lines are connected to the cells arranged in a second direction intersecting with the first direction in the cell array. A decoder selects a selection line from among the first lines in accordance with a logical row address corresponding to each of the physical rows and applies a read voltage or a write voltage to the selection line. A sense amplifier detects data from the second lines. Logical row addresses corresponding to physical rows adjacent to a certain physical row among the physical rows differ between the first sub array and the second sub array.

    SEMICONDUCTOR DEVICE
    3.
    发明公开

    公开(公告)号:US20240057314A1

    公开(公告)日:2024-02-15

    申请号:US18448703

    申请日:2023-08-11

    CPC classification number: H10B12/33 H01L29/7869 H01L29/78642 H10B12/48

    Abstract: According to one embodiment, a semiconductor device includes a semiconductor substrate and a capacitor that includes a first electrode extending in a first direction intersecting the semiconductor substrate and a second electrode facing the first electrode. A first conductive layer is above the capacitor and extends in a second direction. A semiconductor layer penetrates the first conductive layer in the first direction. A first conductor can be above or below the first conductive layer and electrically connected to the first conductive layer. A first insulating film is between the first conductive layer and the semiconductor layer. A second conductive layer extends in the second direction and is electrically connected to the first conductive layer via the first conductor.

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