公开(公告)号：US20230054378A1

公开(公告)日：2023-02-23

申请号：US17979550

申请日：2022-11-02

Applicant: Kioxia Corporation

Inventor： Tetsuya KUROSAWA

IPC: H01L23/00

Abstract: According to one embodiment, in a semiconductor manufacturing apparatus, a controller relatively moves a bonding tool and a stage close to each other while causing a semiconductor chip to adhere by suction to a surface via a tape using at least a first suction structure in a first period. In a second period, the controller controls the temperature of the bonding tool to a first target temperature while keeping substantially equal to a target pressure a pressure applied to the semiconductor chip by the bonding tool. In a third period, the controller controls a relative distance between the bonding tool and the stage so that the pressure applied to the semiconductor chip by the bonding tool is kept equal to the target pressure and controls the temperature of the bonding tool to a second target temperature. The second target temperature is higher than the first target temperature.

公开(公告)号：US20240087970A1

公开(公告)日：2024-03-14

申请号：US18463807

申请日：2023-09-08

Applicant: Kioxia Corporation

Inventor： Takeori MAEDA ,  Tetsuya KUROSAWA

IPC: H01L23/14 ,  H01L21/52 ,  H01L21/683 ,  H01L23/10 ,  H01L23/538

CPC classification number: H01L23/142 ,  H01L21/52 ,  H01L21/6836 ,  H01L23/10 ,  H01L23/5384

Abstract: According to one embodiment, a semiconductor device includes a wiring board, an adhesive, a semiconductor module, and a sealing member. The wiring board includes a step at an outer peripheral. The adhesive is provided on the wiring board. The semiconductor module is disposed on the adhesive. The semiconductor module is mounted inward from the step of the wiring board. The sealing member covers the step, a side surface of the adhesive, and the semiconductor module. The step includes a side surface and a bottom surface. The side surface faces an outside of the wiring board. The bottom surface extends from a lower end of the side surface toward an end part of the wiring board. The side surface of the step and the side surface of the adhesive are positioned to overlap with one another in a view from a stacking direction of the adhesive and the semiconductor module.