公开(公告)号：US06921720B2

公开(公告)日：2005-07-26

申请号：US10227930

申请日：2002-08-26

申请人： Kiyoshi Arita ,  Tetsuhiro Iwai ,  Junichi Terayama

发明人： Kiyoshi Arita ,  Tetsuhiro Iwai ,  Junichi Terayama

IPC分类号： H01L21/3065 ,  H01L21/683 ,  H01L21/302

CPC分类号： H01J37/32082 ,  H01J2237/20 ,  H01L21/3065 ,  H01L21/6833

摘要： In a plasma treating apparatus for carrying out a plasma treatment over a silicon wafer 6 having a protective tape 6a stuck to a circuit formation face, the silicon wafer 6 is mounted on a mounting surface 3d which is provided on an upper surface of a lower electrode 3 formed of a conductive metal with the protective tape 6a turned toward the mounting surface 3d. When a DC voltage is to be applied to the lower electrode 3 by a DC power portion 18 for electrostatic adsorption to adsorb and hold the silicon wafer 6 onto the lower electrode 3 in the plasma treatment, the protective tape 6a is utilized as a dielectric for the electrostatic adsorption. Consequently, the dielectric can be thinned as much as possible and the silicon wafer 6 can be held by a sufficient electrostatic holding force.

摘要翻译： 在具有粘附到电路形成面的保护带6a的硅晶片6上进行等离子体处理的等离子体处理装置中，硅晶片6安装在设置在电路形成面的上表面上的安装面3d上 由导电金属形成的下电极3与保护带6a朝向安装表面3d转动。 当通过用于静电吸附的DC电力部分18将直流电压施加到下电极3上以在等离子体处理中将硅晶片6吸附并保持在下电极3上时，保护带6a用作电介质 用于静电吸附。 因此，尽可能地减薄电介质，并且能够通过足够的静电保持力来保持硅晶片6。

公开(公告)号：US20050279459A1

公开(公告)日：2005-12-22

申请号：US11147882

申请日：2005-06-08

申请人： Kiyoshi Arita ,  Tetsuhiro Iwai ,  Junichi Terayama

发明人： Kiyoshi Arita ,  Tetsuhiro Iwai ,  Junichi Terayama

IPC分类号： H01L21/3065 ,  H01L21/683 ,  C23F1/00

CPC分类号： H01J37/32082 ,  H01J2237/20 ,  H01L21/3065 ,  H01L21/6833

摘要： In a plasma treating apparatus for carrying out a plasma treatment over a silicon wafer 6 having a protective tape 6a stuck to a circuit formation face, the silicon wafer 6 is mounted on a mounting surface 3d which is provided on an upper surface of a lower electrode 3 formed of a conductive metal with the protective tape 6a turned toward the mounting surface 3d. When a DC voltage is to be applied to the lower electrode 3 by a DC power portion 18 for electrostatic adsorption to adsorb and hold the silicon wafer 6 onto the lower electrode 3 in the plasma treatment, the protective tape 6a is utilized as a dielectric for the electrostatic adsorption. Consequently, the dielectric can be thinned as much as possible and the silicon wafer 6 can be held by a sufficient electrostatic holding force.

公开(公告)号：US6006063A

公开(公告)日：1999-12-21

申请号：US255267

申请日：1999-02-23

申请人： Tadafumi Shimizu ,  Hidehiko Inokuchi ,  Tetsuya Mitsuyasu ,  Hiroyuki Noda ,  Junichi Terayama

发明人： Tadafumi Shimizu ,  Hidehiko Inokuchi ,  Tetsuya Mitsuyasu ,  Hiroyuki Noda ,  Junichi Terayama

IPC分类号： G03G15/20 ,  G03G15/00

CPC分类号： G03G15/2025 ,  G03G2215/018 ,  G03G2215/2093

摘要： A fixing roller cooperates with a pressing roller to heat and press a toner image to a recording medium so as to fix the toner image to the recording medium. A sheet-like web is impregnated with a mold release for supplying the mold release to a surface of the fixing roller by being pressed by the pressing roller. A first shaft has an unused portion of the web wound therearound, and a second shaft takes up the web after supplying the mold release to the fixing roller. A coil spring applies a rotational force in a direction opposite to a direction of drawing out the web relative to the first shaft so as to apply a tension to the web, thereby automatically removing slackness of the web.

摘要翻译： 定影辊与加压辊配合，将调色剂图像加热并压到记录介质上，以将调色剂图像固定在记录介质上。 片状网被浸渍有脱模剂，用于通过被加压辊按压将脱模剂提供给定影辊的表面。 第一轴具有卷绕在其周围的幅材的未使用部分，并且在向定影辊提供释放之后第二轴接收幅材。 螺旋弹簧沿与纸幅相对于第一轴拉出方向相反的方向施加旋转力，以向幅材施加张力，从而自动消除幅材的松弛。