公开(公告)号：US20060024194A1

公开(公告)日：2006-02-02

申请号：US11237918

申请日：2005-09-29

申请人： Koichi Izumida ,  Yuki Takano ,  Hitoshi Abe ,  Toshiyuki Moribayashi ,  Koichi Hagio ,  Junichi Takenaka

发明人： Koichi Izumida ,  Yuki Takano ,  Hitoshi Abe ,  Toshiyuki Moribayashi ,  Koichi Hagio ,  Junichi Takenaka

IPC分类号： C22C13/00 ,  B32B15/01

CPC分类号： B23K35/0266 ,  B23K35/262 ,  B23K2101/38 ,  B23K2103/12 ,  C22C13/00 ,  H01F27/29 ,  H01F41/10 ,  Y10T428/12715

摘要： Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented. Solder attachment of connecting portions of insulation coated conductors having copper as a base material is carried out by melting lead-free solder alloy containing from 5.3 to 7.0 wt % copper (Cu), from 0.1 to less than 0.5 wt % nickel (Ni), with a remainder being tin (Sn), at a temperature ranging from 400° C. to 480° C.

摘要翻译： 防止使用具有铜或合金含有合金的芯的绝缘涂层导体的电子部件的导体焊接附着时的断线故障。 以铜为基体的绝缘涂层导体的连接部分的焊接是通过熔化含有5.3至7.0重量％铜（Cu）的无铅焊料合金，从0.1至小于0.5重量％的镍（Ni）， 余量为锡（Sn），温度范围为400〜480℃。

公开(公告)号：US20090173770A1

公开(公告)日：2009-07-09

申请号：US12379238

申请日：2009-02-17

申请人： Koichi Izumida ,  Yuki Takano ,  Hitoshi Abe ,  Toshiyuki Moribayashi ,  Koichi Hagio ,  Junichi Takenaka

发明人： Koichi Izumida ,  Yuki Takano ,  Hitoshi Abe ,  Toshiyuki Moribayashi ,  Koichi Hagio ,  Junichi Takenaka

IPC分类号： B23K1/20

CPC分类号： B23K35/0266 ,  B23K35/262 ,  B23K2101/38 ,  B23K2103/12 ,  C22C13/00 ,  H01F27/29 ,  H01F41/10 ,  Y10T428/12715

摘要： Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented.Solder attachment of connecting portions of insulation coated conductors having copper as a base material is carried out by melting lead-free solder alloy containing from 5.3 to 7.0 wt % copper (Cu), from 0.1 to less than 0.5 wt % nickel (Ni), with a remainder being tin (Sn), at a temperature ranging from 400° C. to 480° C.

摘要翻译： 防止使用具有铜或合金含有合金的芯的绝缘涂层导体的电子部件的导体焊接附着时的断线故障。 以铜为基体的绝缘涂层导体的连接部分的焊接是通过熔化含有5.3至7.0重量％铜（Cu）的无铅焊料合金，从0.1至小于0.5重量％的镍（Ni）， 余量为锡（Sn），温度范围为400〜480℃。

公开(公告)号：US07005106B2

公开(公告)日：2006-02-28

申请号：US10433461

申请日：2001-08-30

申请人： Koichi Izumida ,  Yuki Takano ,  Hitoshi Abe ,  Toshiyuki Moribayashi ,  Koichi Hagio ,  Junichi Takenaka

发明人： Koichi Izumida ,  Yuki Takano ,  Hitoshi Abe ,  Toshiyuki Moribayashi ,  Koichi Hagio ,  Junichi Takenaka

IPC分类号： B23K35/26

CPC分类号： B23K35/262

摘要： Prevented is disconnection, and generation of the bridging effect which causes short circuits between terminals, when electric wire having an insulating coating and terminals are soldered together, in electronic components which are constituted using electric wire having an insulating coating, the core wire thereof being copper or a copper alloy, and in which electronic components distances between neighboring terminals are narrow.Electric wire having an insulating coating, the base metal of which is copper, and terminal portions (connection portions) are soldered together by means of a lead-free solder alloy, which contains 3.0 to 5.5 wt % copper (Cu); 0.1 to 0.5 wt % nickel (Ni); and 0.001 to 0.1 wt % germanium (Ge), the remainder of the solder alloy consisting of tin (Sn).

摘要翻译： 在使用具有绝缘涂层的电线构成的电子部件中，当将具有绝缘涂层和端子的电线焊接在一起时，防止断开，产生引起端子之间短路的桥接效应，其芯线为铜 或铜合金，并且其中相邻端子之间的电子部件距离窄。