公开(公告)号：USD354048S

公开(公告)日：1995-01-03

申请号：US6883

申请日：1993-04-12

申请人： Koji Kimura ,  Yoshihiro Ueda ,  Takeshi Ichimaru ,  Yukihiko Oashi

设计人： Koji Kimura ,  Yoshihiro Ueda ,  Takeshi Ichimaru ,  Yukihiko Oashi

公开(公告)号：US20090289100A1

公开(公告)日：2009-11-26

申请号：US12320496

申请日：2009-01-27

申请人： Tetsuji Ishikawa ,  Yukihiko Oashi ,  Shizuo Ishijima

发明人： Tetsuji Ishikawa ,  Yukihiko Oashi ,  Shizuo Ishijima

IPC分类号： B23K31/02 ,  B23K1/018

CPC分类号： B23K1/018 ,  B23K1/0053 ,  B23K3/04 ,  B23K2101/42 ,  H05K3/3494 ,  H05K2203/1121 ,  H05K2203/176 ,  H05K2203/304

摘要： A method is disclosed for performing rework soldering for removing an electronic component from a printed circuit board and re-soldering the electronic component to the printed circuit board. The method includes the steps of positioning a dual structure body including a heating member and a cooling member between a rework target and a non-rework target placed on the printed circuit board, the heating member and the cooling member being arranged facing each other with a slight space provided therebetween, the heating member being situated toward the rework target, the cooling member being situated toward the non-rework target; heating the heating member; and cooling the cooling member.

摘要翻译： 公开了一种用于执行返修焊接以从印刷电路板移除电子部件并将电子部件重新焊接到印刷电路板的方法。 该方法包括以下步骤：将包括加热构件和冷却构件的双结构体定位在放置在印刷电路板上的返工对象和非返修对象之间，加热构件和冷却构件彼此面对地布置 所述加热构件朝向所述返工目标定位，所述冷却构件朝向所述非返修目标定位; 加热加热构件; 并冷却冷却部件。