公开(公告)号：US20180190430A1

公开(公告)日：2018-07-05

申请号：US15909735

申请日：2018-03-01

申请人： KEMET Electronics Corporation

发明人： John E. McConnell ,  Garry L. Renner ,  John Bultitude ,  Allen Hill

IPC分类号： H01G4/228 ,  H01G4/12 ,  H01G4/008 ,  H01G4/38 ,  B23K1/00 ,  B23K1/005 ,  B23K1/008 ,  B23K1/20 ,  B23K35/36

CPC分类号： H01G4/228 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/38 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00

摘要： A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.

公开(公告)号：US20170028494A1

公开(公告)日：2017-02-02

申请号：US15300818

申请日：2015-03-31

申请人： CENTROTHERM PHOVOLTAICS AG

发明人： Matthias Usenbenz ,  Reinhard Lenz

IPC分类号： B23K1/008 ,  B23K3/08 ,  B23K1/005

CPC分类号： B23K1/008 ,  B23K1/0053 ,  B23K3/087 ,  B23K2101/36

摘要： The invention describes an apparatus and a method for soldering mating parts, in particular electrical components to circuit boards or other carrier elements. The mating parts may be received and pressed together between two plate elements. One of the plate elements, which is heatable, may be flexible and may be elastically biased in the direction of the other plate element, by means of a plurality of elastically biased elements. Alternatively or additionally, heating may be provided for both plate elements.

摘要翻译： 本发明描述了一种用于将配合部件，特别是电气部件焊接到电路板或其它载体元件的装置和方法。 配合部件可以被接收并压在两个板件之间。 可加热的板元件中的一个可以是柔性的并且可以通过多个弹性偏置元件在另一个板元件的方向上弹性偏置。 或者或另外，可以为两个板元件提供加热。

公开(公告)号：US09472342B2

公开(公告)日：2016-10-18

申请号：US13959954

申请日：2013-08-06

申请人： Kemet Electronics Corporation

发明人： John E. McConnell ,  Garry L. Renner ,  John Bultitude ,  Allen Hill

IPC分类号： H01G4/228 ,  H01G4/06 ,  B23K1/00 ,  B23K1/005 ,  B23K1/008 ,  B23K1/20 ,  B23K35/36 ,  B23K35/02 ,  H01G4/30 ,  H01G4/232 ,  H01G4/008 ,  H01G4/12 ,  H01G4/38

CPC分类号： H01G4/228 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/38 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00

摘要： A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.

摘要翻译： 提供堆叠的MLCC电容器，其中电容器堆叠包括多层陶瓷电容器，其中每个多层陶瓷电容器包括第一电极和交替堆叠的第二电极，每个第一电极和每个相邻的第二电极之间具有电介质。 第一电极在第一侧和第二电极的第二侧终止。 第一瞬态液相烧结导电层是第一侧并与每个第一电极电接触; 并且第二瞬态液相烧结导电层位于第二侧上并与每个第二电极电接触。

公开(公告)号：US20140034716A1

公开(公告)日：2014-02-06

申请号：US13564542

申请日：2012-08-01

申请人： Dason Cheung ,  Murad Kurwa ,  Richard Loi ,  Mario Lopez Ruiz

发明人： Dason Cheung ,  Murad Kurwa ,  Richard Loi ,  Mario Lopez Ruiz

IPC分类号： B23K31/02 ,  B23K3/04

CPC分类号： H01L31/048 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/012 ,  B23K1/018 ,  B23K1/08 ,  B23K1/20 ,  B23K3/04 ,  B23K3/047 ,  B23K3/0471 ,  B23K3/08 ,  B23K2101/38 ,  H01L31/0547 ,  H01L2924/0002 ,  Y02E10/52 ,  H01L2924/0001

摘要： A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant.

摘要翻译： 太阳能电池模块包括焊接到基板的太阳能电池模具。 衬底包括一个或多个电源触点。 电力导体焊接到电源触点，从而将电力导体电耦合到太阳能电池模具。 预热模块将第一区域的衬底的第一侧加热至第一温度持续第一时间。 然后，焊接热源在第二温度下将功率导体焊接到衬底的第二区域处的功率接触持续第二持续时间。 在电源导体处产生的焊接连接不太容易发生冷焊缺陷。 控制预热模块的温度以促进用于制造太阳能电池模块的RTV密封剂的固化。 控制焊料热源的温度以避免RTV密封胶的燃烧和降解。

公开(公告)号：US20130206230A1

公开(公告)日：2013-08-15

申请号：US13808571

申请日：2011-07-22

申请人： Srinivasan Sridharan ,  Robert P. Blonski ,  Chandrashekhar Khadilkar ,  John J. Maloney

发明人： Srinivasan Sridharan ,  Robert P. Blonski ,  Chandrashekhar Khadilkar ,  John J. Maloney

IPC分类号： B23K1/19 ,  B23K31/02 ,  H01L31/18 ,  H05K13/00 ,  H01L31/048

CPC分类号： B23K1/0008 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/005 ,  B23K1/0053 ,  B23K1/0056 ,  B23K1/06 ,  B23K1/19 ,  B23K31/02 ,  B23K35/262 ,  C03C27/08 ,  H01G9/2077 ,  H01L23/10 ,  H01L31/048 ,  H01L31/0488 ,  H01L31/18 ,  H01L51/5246 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K13/00 ,  Y02E10/50 ,  Y10T156/10 ,  Y10T156/1062 ,  H01L2924/00

摘要： Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.

摘要翻译： 焊接可用于将玻璃基板湿润并粘合在一起，以确保在电气和电子应用中比常规聚合物（热塑性或热塑性弹性体）密封件更好（更不易穿透）的气密密封。

公开(公告)号：US20130146647A1

公开(公告)日：2013-06-13

申请号：US13313371

申请日：2011-12-07

申请人： Chung-Shi Liu ,  Chien Ling Hwang ,  Bor-Ping Jang ,  Ying-Jui Huang

发明人： Chung-Shi Liu ,  Chien Ling Hwang ,  Bor-Ping Jang ,  Ying-Jui Huang

IPC分类号： B23K31/02

CPC分类号： B23K1/0016 ,  B23K1/0053 ,  B23K1/012 ,  B23K1/206 ,  B23K2101/42 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/75272 ,  H01L2224/75283 ,  H01L2224/75651 ,  H01L2224/765 ,  H01L2224/81097 ,  H01L2224/81211 ,  H01L2224/81912 ,  H01L2224/81948 ,  H01L2924/00012 ,  H01L2924/014

摘要： A method includes reflowing a solder region of a package structure, and performing a cleaning on the package structure at a cleaning temperature higher than a room temperature. Between the step of reflowing and the step of cleaning, the package structure is not cooled to temperatures close to the room temperature.

摘要翻译： 一种方法包括回流包装结构的焊料区域，并且在高于室温的清洁温度下对包装结构进行清洁。 在回流步骤和清洁步骤之间，封装结构没有被冷却到接近于室温的温度。

公开(公告)号：US20100089720A1

公开(公告)日：2010-04-15

申请号：US12449870

申请日：2008-11-05

申请人： Masanari Matsuura ,  Sotaro Ol ,  Tomoyuki Kubota ,  Masaya Tsuruta

发明人： Masanari Matsuura ,  Sotaro Ol ,  Tomoyuki Kubota ,  Masaya Tsuruta

IPC分类号： B65G47/26

CPC分类号： B23K1/005 ,  B23K1/0053 ,  B23K1/0056 ,  B23K1/008 ,  B23K3/08 ,  B23K35/0233 ,  B23K35/26 ,  F27B9/2469 ,  F27B9/26 ,  F27D3/12 ,  F27D3/123 ,  H05K3/0008 ,  H05K3/3494 ,  H05K2203/1509

摘要： A conveyance section positioning method has carrier pallets (40) on which workpieces are fixed, a conveyer (20), a heating furnace (13) for heating the workpieces, and a positioning mechanism for positioning the carrier pallets (40), and the method stops the carrier pallets (40) at predetermined positions. The heating furnace (13) has halogen heaters (30) for heating the workpieces. The carrier pallets (40) each have projections (41) and output grooves (42). Comb tooth-shaped stopper projections (35a) engaging with the projections (41) are formed on a carrier stopper (35). When the carrier stopper (35) is moved forward, the stopper projections (35a) and the projections (41) are engaged with each other. In this one operation, the carrier pallets (40) are positioned at places corresponding to the halogen heaters (30), and then the workpieces are heated.

摘要翻译： 输送部定位方法具有固定有工件的托盘托架（40），用于加热工件的输送机（20），加热炉（13）和用于定位托架托盘（40）的定位机构， 将托架托盘（40）停止在预定位置。 加热炉（13）具有用于加热工件的卤素加热器（30）。 载体托盘（40）各具有突起（41）和输出槽（42）。 与突起（41）接合的梳齿形止动突起（35a）形成在载体塞（35）上。 当行星架止动器（35）向前移动时，止动突起（35a）和突起（41）彼此接合。 在这一个操作中，载体托盘（40）位于与卤素加热器（30）相对应的位置，然后加热工件。

公开(公告)号：US06844532B2

公开(公告)日：2005-01-18

申请号：US10399896

申请日：2002-02-04

申请人： Hiroshi Takamura ,  Daisuke Takagaki

发明人： Hiroshi Takamura ,  Daisuke Takagaki

IPC分类号： B23K1/005 ,  B23K1/008 ,  H05B3/10 ,  H05B3/14 ,  H05B3/62 ,  H05B3/64 ,  H05B3/12

CPC分类号： H05B3/62 ,  B23K1/0053 ,  B23K1/008 ,  H05B3/143 ,  H05B3/64 ,  H05B2203/018 ,  Y10T29/49083

摘要： A MoSi2 arc-shaped heater formed in a continuous waveform, characterized in that U-shaped heater members having parallel parts are connected alternately to each other at the end parts, and the parallel faces of the U-shaped heater members have an angle relative to each other and an arc-shaped face with a specified curvature in a connecting direction, wherein a large number of parallel U-shaped heater members having heating parts are connected to each other and welded so that the heater can have a generally arc-shaped curved surface to install the heater onto the inner wall of a heating furnace, whereby the arc heater having an excellent joining strength and capable of being manufactured stably, and a method and a device for manufactured the heater can be provided.

摘要翻译： 形成为连续波形的MoSi 2弧形加热器，其特征在于，具有平行部分的U形加热器部件在端部彼此交替连接，并且U形加热器部件的平行面相对于 彼此连接并且具有在连接方向上具有特定曲率的弧形面，其中具有加热部件的大量平行的U形加热器部件彼​​此连接并焊接，使得加热器可以具有大致弧形的弯曲 表面，以将加热器安装在加热炉的内壁上，由此可以提供具有优异的接合强度并且能够稳定制造的电弧加热器，以及用于制造加热器的方法和装置。

公开(公告)号：US06793120B2

公开(公告)日：2004-09-21

申请号：US10346637

申请日：2003-01-17

申请人： William A. Johnson

发明人： William A. Johnson

IPC分类号： B23K3102

CPC分类号： B23K1/0053 ,  B23K2101/32

摘要： An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which functions to direct the radiant energy from the lamp to a target region generally corresponding with the location of the solder layer between the electrical connector and the conductive element. The heating device is operable to rapidly and substantially heat the solder layer to a desired temperature to melt the solder layer, while substantially limiting directing of heat to the glass sheet. The electrical connector may be affixed at a vehicular or modular window assembly plant, such that the glass sheet may be transported from a glass manufacturing plant to the vehicular or modular window assembly plant without the electrical connector.

摘要翻译： 电连接器通过使用红外线辐射加热装置的一层焊料的辐射加热焊接或固定到车窗玻璃板的导电元件上。 加热装置可以包括红外灯和反射器，其用于将来自灯的辐射能引导到通常对应于电连接器和导电元件之间的焊料层的位置的目标区域。 加热装置可操作以将焊料层快速且基本上加热到期望的温度以熔化焊料层，同时基本上限制将热量导向玻璃板。 电连接器可以固定在车辆或模块化的窗户组装工厂，使得玻璃板可以从玻璃制造厂运输到车辆或模块化的窗户组装设备，而无需电连接器。

公开(公告)号：US20030075589A1

公开(公告)日：2003-04-24

申请号：US09683802

申请日：2002-02-19

发明人： Szu-Hsiung Ko

IPC分类号： B23K031/00 ,  B23K031/02

CPC分类号： H05K3/3415 ,  B23K1/0053 ,  B23K2101/42 ,  H05K3/0097 ,  H05K2203/1563 ,  H05K2203/1572 ,  Y02P70/613

摘要： A method for mounting components on an abutted circuit board. The main abutted circuit board has N first circuit boards and N second circuit boards, where N is a positive integer. Each of the abutted circuit boards has a front side and a rear side. The front sides of the first circuit boards abut on the rear sides of the second circuit boards. The method includes placing the circuit boards in a component mounter for mounting a plurality of components on the front sides of the first circuit boards and mounting a plurality of components on the rear sides of the second circuit boards. The method also includes placing the circuit boards in the component mounter for mounting a plurality of components on rear sides of the first circuit boards and mounting a plurality of components on front sides of the second circuit boards.

摘要翻译： 一种用于将部件安装在邻接电路板上的方法。 主要邻接电路板具有N个第一电路板和N个第二电路板，其中N是正整数。 每个邻接的电路板具有前侧和后侧。 第一电路板的前侧邻接第二电路板的后侧。 该方法包括将电路板放置在用于将多个部件安装在第一电路板的前侧上的部件安装器中，并将多个部件安装在第二电路板的后侧上。 该方法还包括将电路板放置在组件安装器中，用于将多个部件安装在第一电路板的后侧，并将多个部件安装在第二电路板的前侧上。