公开(公告)号：US20070022558A1

公开(公告)日：2007-02-01

申请号：US11189501

申请日：2005-07-26

申请人： Krassimir Petkov ,  Gunter Erdmann ,  Rolf Seichter

发明人： Krassimir Petkov ,  Gunter Erdmann ,  Rolf Seichter

IPC分类号： B60S1/04 ,  B60S1/06 ,  B60S1/44 ,  B60S1/32

CPC分类号： B60S1/0477 ,  B60S1/08 ,  B60S1/40 ,  B60S1/42 ,  B60S1/44

摘要： A method is provided for improving the wiping capabilities of a windshield wiper by causing the windshield wiper blade to vibrate or oscillate in a direction parallel to the longitudinal centerline of the blade during a windshield wiper sweep. The vibrating mode causes less wear on the blade due to windshield abrasion since the blade edge does not contact the same eroded point on the windshield all the time. Secondly, any debris that is caught underneath the blade is quickly ejected due to the vibrating action. In one embodiment, an electromechanical vibrating unit is secured at one or more positions to the blade, with the actuator being driven by a 12-volt source and provided with a quickie disconnect at the center of the blade support structure. The vibrating actuator may be an electromechanically drive off-centered weight, a vibrating linear actuator, an ultrasonic vibrator, or a vibrator in the form of a piezoelectric crystal, with the primary mode of oscillation translating the blade along its centerline. The result is that debris underneath the blade is thrown out, including leaf stems, leaves and particulate matter, with the periodic translation of the blade providing more uniform water removal during the wiping operation to provide clearer visibility through the windshield regardless of the amount of water on the windshield, whether it be from a sporadic sprinkle or a torrential downpour. Wiper life is extended since the blade edge's position on the windshield is constantly varied during wiper sweeps.

摘要翻译： 提供了一种用于通过在挡风玻璃刮水器扫掠期间使挡风玻璃刮水片在平行于叶片的纵向中心线的方向上振动或振荡来改善挡风玻璃刮水器的擦拭能力的方法。 振动模式由于挡风玻璃的磨损而导致叶片的磨损较少，因为叶片边缘始终不与挡风玻璃上的相同的侵蚀点接触。 其次，由于振动的作用，任何被夹在叶片下方的碎片都会迅速弹起。 在一个实施例中，机电振动单元在一个或多个位置处固定到叶片，致动器由12伏电源驱动并且在叶片支撑结构的中心处设置有快速断开。 振动致动器可以是机电驱动的偏心重量，振动的线性致动器，超声波振动器或压电晶体形式的振动器，其中主要的振荡模式使叶片沿其中心线平移。 结果是叶片下面的碎片被丢弃，包括叶茎，叶和颗粒物，刀片的周期性平移在擦拭操作期间提供更均匀的除水，以提供更清晰的通过挡风玻璃的可见度，而不管水的量如何 在挡风玻璃上，无论是从零星的洒水还是暴雨。 刮水器寿命延长，因为在刮水器扫掠期间叶片边缘在挡风玻璃上的位置不断变化。

公开(公告)号：US06494134B2

公开(公告)日：2002-12-17

申请号：US09836736

申请日：2001-04-17

申请人： Gunter Erdmann

发明人： Gunter Erdmann

IPC分类号： B05C1708

CPC分类号： B05C17/08 ,  B41F15/36 ,  H05K3/1225

摘要： A stencil foil assembly includes a stencil foil, having a stencil pattern thereon, of a planar configuration secured to a rigid frame with an upstanding wall and a support flange emanating inwardly from the upstanding wall. The stencil foil resides on the support flange with the bottom surface of the periphery of the stencil foil being in communication with the top surface of said support flange. The outer edge of the stencil foil is positioned adjacent to the inner surface of said upstanding wall. The periphery of the stencil foil is secured to the rigid frame. The stencil foil assembly protects a user from injury by preventing contact with the sharp outer edges of the stencil foil. The assembly protects the stencil foil portion from damage and greatly facilitates handling thereof.

摘要翻译： 模板箔组件包括在其上具有模板图案的模板箔，其具有固定到刚性框架的平面构型，其具有从直立壁向内发出的直立壁和支撑凸缘。 模板箔位于支撑凸缘上，其中模板箔的周边的底表面与所述支撑凸缘的顶表面连通。 模板箔的外边缘邻近所述直立壁的内表面定位。 模板箔的周边固定在刚性框架上。 模板箔组件通过防止与模板箔的锋利的外边缘的接触来保护使用者免受伤害。 组件保护模板箔部分免受损坏并且极大地便于其处理。

公开(公告)号：US5044306A

公开(公告)日：1991-09-03

申请号：US535847

申请日：1990-06-11

申请人： Gunter Erdmann

发明人： Gunter Erdmann

IPC分类号： B23K3/06 ,  H05K3/12

CPC分类号： B23K3/0692 ,  H05K3/1233 ,  H05K2203/0139

摘要： Mechanism is disclosed for wiping solder paste onto a printed circuit board through a stencil superposed on the board, including a first squeeges for wiping solder paste onto the stencil, a second squeegee for depositing solder paste at a location for engagement by the first squeeges and a tray, alternatively engagable with both squeeges to cooperate with the squeeges to deposit solder paste at the beginning of a wiping stroke and to pick up excess solder paste at the end of a wiping stroke.

摘要翻译： 公开了通过叠加在板上的模板将焊膏擦拭到印刷电路板上的机构，包括用于将焊膏擦拭到模板上的第一刮板，用于在通过第一挤压器接合的位置处沉积焊膏的第二刮板 托盘，或者可与两个挤压器接合，以在擦拭行程开始时与所述挤压合并以沉积焊膏，并在擦拭行程结束时拾取多余的焊膏。

公开(公告)号：US06638363B2

公开(公告)日：2003-10-28

申请号：US10273205

申请日：2002-10-17

申请人： Gunter Erdmann

发明人： Gunter Erdmann

IPC分类号： B08B704

CPC分类号： H05K3/1233 ,  B23K1/0008 ,  B23K1/018 ,  B23K2101/42 ,  H05K3/1216 ,  H05K3/26 ,  H05K2203/0139

摘要： A cleaning apparatus for cleaning solder paste off the bottom side of a printed circuit board stencil includes a container of cleaning solution therein and a blade holder that is movable between a wiping position and the container of cleaning solution. A wiping blade is mounted in the blade holder. The blade holder, with the blade mounted thereon, is reciprocated back and forth when in communication with a stencil to be cleaned. The blade is moved from the wiping position in communication with the stencil into the cleaning solution in the container. A pneumatic piston and rotary actuator provides controlled movement of the wiping blade. The wiping blade may be vibrated during wiping to improve removal of solder paste from the stencil and the cleaning solution may be ultrasonically vibrated to improve removal of solder paste from the wiping blade. The wiping blade may also be pulsed into a sponge to remove excess cleaning solution prior to the next cleaning cycle. After cleaning, the cleaning solution may be filtered and reused in a closed loop method.

公开(公告)号：US5522929A

公开(公告)日：1996-06-04

申请号：US297595

申请日：1994-08-29

申请人： Gunter Erdmann

发明人： Gunter Erdmann

IPC分类号： B41F15/42 ,  H05K3/12 ,  B05C7/00

CPC分类号： H05K3/1233 ,  B41F15/423 ,  H05K2203/0139

摘要： This invention improves a machine that has a squeegee-like blade that wipes across an apertured mask to apply to a printed circuit board solder paste or other conductive mounting material. The apparatus and method of the invention involve reciprocating the blade back and forth transverse to the direction of blade sweep across the mask, during the material-applying sweep of the blade across the mask. The reciprocating movement of the blade, combined with the sweep movement, deposits material onto the printed circuit board with high fidelity and with minimal voids.

摘要翻译： 本发明改进了一种具有刮刀状刀片的机器，其擦拭穿过孔径掩模以应用于印刷电路板焊膏或其它导电安装材料。 本发明的装置和方法涉及在刀片穿过掩模的材料施加扫描期间横向于刀片扫掠的方向横向穿过掩模使叶片往复运动。 刀片的往复运动与扫掠运动相结合，以高保真度和最小的空隙将材料沉积在印刷电路板上。

公开(公告)号：US20060244190A1

公开(公告)日：2006-11-02

申请号：US11204478

申请日：2005-08-16

申请人： Gunter Erdmann

发明人： Gunter Erdmann

IPC分类号： B25B5/16

CPC分类号： H05K13/0069

摘要： Pin supported printed circuit boards are provided with torsion spring locking assemblies in which torsion springs surround the pins and are captured at one end and have free ends that are deflected, causing a tight grip onto the pins. The result is a pin locking mechanism that is inexpensive and robust due to the elongated contact of the spring with the pin that firmly locks the pin in place, with the extended spring contact protecting the pins against abrading and scoring while providing exceptional locking force.

摘要翻译： 针脚支撑的印刷电路板设有扭转弹簧锁定组件，其中扭簧围绕销并且在一端被捕获并且具有偏转的自由端，导致紧紧地抓住销。 结果是销钉锁定机构，由于弹簧与销的细长接触而将销钉牢固地锁定在适当位置，因此延伸的弹簧接触件保护销不受磨损和刻痕的影响，同时提供卓越的锁定力，因此销售锁定机构是便宜而坚固的。

公开(公告)号：US06491204B1

公开(公告)日：2002-12-10

申请号：US09721282

申请日：2000-11-22

申请人： Gunter Erdmann

发明人： Gunter Erdmann

IPC分类号： B23K100

CPC分类号： H05K3/1233 ,  B23K1/018 ,  B23K2101/42 ,  H05K3/1216 ,  H05K3/26 ,  H05K2203/0139

摘要： A cleaning apparatus for cleaning solder paste off the bottom side of a printed circuit board stencil includes a container of cleaning solution therein and a blade holder that is movable between a wiping position and the container of cleaning solution. A wiping blade is mounted in the blade holder. The blade holder, with the blade mounted thereon, is reciprocated back and forth when in communication With a stencil to be cleaned. The blade is moved from the wiping position in communication with the stencil into the cleaning solution in the container. A pneumatic piston and rotary actuator provides controlled movement of the wiping blade. The wiping blade may be vibrated during wiping to improve removal of solder paste from the stencil and the cleaning solution may be ultrasonically vibrated to improve removal of solder paste from the wiping blade. The wiping blade may also be pulsed into a sponge to remove excess cleaning solution prior to the next cleaning cycle. After cleaning, the cleaning solution may be filtered and reused in a closed loop method.

摘要翻译： 用于从印刷电路板模板的底侧清洗焊膏的清洁装置包括其中的清洁溶液容器和可在擦拭位置和清洁溶液容器之间移动的刀片保持器。 刮刀安装在刀架上。 当与要清洁的模板连通时，具有安装在其上的刀片的刀片保持器来回往复运动。 刀片从与模板连通的擦拭位置移动到容器中的清洁溶液中。 气动活塞和旋转致动器提供刮刀的受控运动。 擦拭刮板可以在擦拭期间振动以改善焊膏从模板的去除，并且清洁溶液可能被超声波振动以改善焊膏从擦拭刀片的去除。 擦拭刀片还可以被脉冲成海绵，以在下一个清洁循环之前去除多余的清洁溶液。 清洁后，清洁溶液可以过滤并以闭环方式重复使用。