专利检索 ap:("Kris J. Whittenburg" OR "Fay Hua" OR "Carl L. Deppisch" OR "Sabina J. Houle" OR "Peter Brandenburger" OR "Kim L. Phillippe") AND inv:"Kris J. Whittenburg" 第 1 页

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发明授权
Integrated heat spreader package for heat transfer and for bond line thickness control and process of making 有权

公开(公告)号：US06867978B2

公开(公告)日：2005-03-15

申请号：US10266996

申请日：2002-10-08

申请人： Kris J. Whittenburg , Fay Hua , Carl L. Deppisch , Sabina J. Houle , Peter Brandenburger , Kim L. Phillippe

发明人： Kris J. Whittenburg , Fay Hua , Carl L. Deppisch , Sabina J. Houle , Peter Brandenburger , Kim L. Phillippe

IPC分类号： H01L23/373 , H01L23/433 , H05K7/20

CPC分类号： H01L23/433 , H01L23/3733 , H01L24/29 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/14 , H01L2924/16152 , H01L2924/00 , H01L2224/0401

摘要： A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.