- 专利标题： Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
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申请号： US10266996申请日： 2002-10-08
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公开(公告)号： US06867978B2公开(公告)日： 2005-03-15
- 发明人: Kris J. Whittenburg , Fay Hua , Carl L. Deppisch , Sabina J. Houle , Peter Brandenburger , Kim L. Phillippe
- 申请人： Kris J. Whittenburg , Fay Hua , Carl L. Deppisch , Sabina J. Houle , Peter Brandenburger , Kim L. Phillippe
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwegman, Lundberg, Woessner & Kluth, P.A.
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; H01L23/433 ; H05K7/20
摘要：
A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.
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