摘要:
An apparatus includes a first signal receiving module, a second signal receiving module, and a signal transmitting module. The first signal receiving module is coupled between a first signal point and a third signal point for receiving a first RF signal from the first signal point. The first signal receiving module down-converts the first RF signal for providing a first down-converted signal at the third signal point. The second signal receiving module is coupled between a second signal point and the third signal point for receiving a second RF signal. The second signal receiving module down-converts said second RF signal for providing a second down-converted signal at the third signal point. The signal transmitting module is coupled between the first and second signal points and the third signal point for receiving a third RF signal from the third signal point. The signal transmitting module up-converts the third RF signal for selectively providing an up-converted signal at one of the first and second signal points in response to a selection signal.
摘要:
Methods of forming scalable systems and scalable systems on an integrated circuit (SoC) are provided. First and second radio frequency (RF) systems are disposed on first and second substrates, respectively. A first processor that is configured to process the first RF system is disposed on a substrate separate from the first substrate and a second processor that is configured to process the second RF system is disposed on a substrate separate from the second substrate. The first processor and the first RF system are stacked one on top of the other to configure a first RFSoC and the second processor and the second RF system are stacked one on top of the other to configure a second RFSoC. The first and second RFSoCs are disposed either in a horizontal plane, laterally spaced from each other, or in vertically stacked planes, one above the other.
摘要:
Methods of forming scalable systems and scalable systems on an integrated circuit (SoC) are provided. First and second radio frequency (RF) systems are disposed on first and second substrates, respectively. A first processor that is configured to process the first RF system is disposed on a substrate separate from the first substrate and a second processor that is configured to process the second RF system is disposed on a substrate separate from the second substrate. The first processor and the first RF system are stacked one on top of the other to configure a first RFSoC and the second processor and the second RF system are stacked one on top of the other to configure a second RFSoC. The first and second RFSoCs are disposed either in a horizontal plane, laterally spaced from each other, or in vertically stacked planes, one above the other.
摘要:
A method for reducing electromagnetic radiation between devices in electrical communication, including processing signals within a first device in a manner tending to reduce EMR, and electromagnetically isolating the processed signals prior to communicating the signals to a subsequent device.
摘要:
The disadvantages associated with the prior art are overcome by a method and apparatus for reducing multipath distortion in a television signal. Specifically, a plurality of antenna elements receive spatially unique replicas of a desired television signal. The spatially unique replicas are coupled to an adaptive combiner, which generates a spatially combined signal to be coupled to a television receiver. The adaptive combiner forms a weighted summation of the spatially unique replicas, which effectively places spatial nulls in the direction of the multipath interference. The weighting information is provided by an adaptive controller that uses intelligence from a multipath processor located within the apparatus. The intelligence may take the form of a figure of merit derived from the combiner output, or from processing preformed on the input signals themselves.
摘要:
A shielded modular tuner is horizontally mounted onto a chassis printed circuit board and is provided, through an aperture in the shield, with lead connections from the edge of the tuner printed circuit board to the chassis printed circuit board, for power supply, control signals, outputting a processed signal, etc. The RF signal is coupled to the tuner via a conductive pin/lead extending from an RF signal conducting path on the chassis printed circuit board, passing through a second aperture in the shield, directly to the point on the tuner printed circuit board where the signal is to be inputted for tuner processing. In this way, the RF signal is injected directly into the tuner precisely where it is needed without being led along a longer and possibly meandering path from the edge of the tuner printed circuit board, and without a shielded coaxial cable and accompanying connectors.