公开(公告)号：US06357131B1

公开(公告)日：2002-03-19

申请号：US09467113

申请日：1999-12-20

Applicant: Kun Pi Cheng ,  I-Chung Chang

Inventor： Kun Pi Cheng ,  I-Chung Chang

IPC: G01B1126

CPC classification number: G03F7/70633 ,  H01L2223/54453 ,  H01L2223/54493

Abstract: A method of overlaying two images and from this overlay observe and measure the accuracy of the alignment of the wafer. Wafer misalignment can be readily corrected based on the results of these observations. Alignment marks are provided on the surface of the wafer that is being validated for accuracy of alignment. The position of this mark relative to a pattern provided on the surface of a control wafer is measured and forms an indication of the alignment of the wafer.

Abstract translation: 覆盖两个图像并从该覆盖物的方法观察并测量晶片对准的精度。 基于这些观察结果可以很容易地校正晶圆偏移。 对准标记提供在正在验证的晶圆表面上以进行对准精度。 该标记相对于设置在控制晶片的表面上的图案的位置被测量并且形成晶片对准的指示。