Abstract:
A method of piping defect detection is provided. A semiconductor substrate having an active region and an isolation region is provided, a plurality of semiconductor elements are formed on the semiconductor substrate, a dielectric layer is deposited on the semiconductor substrate and the semiconductor elements, and first and second contact plugs are formed in the dielectric layer to connect the active region and the isolation region respectively. The first contact plug and the second contact plug are illuminated by an electron beam, accumulating charge on the second contact plug, and piping defects are detected between the first contact plug and the second contact plug according to brightness contrast between the first contact plug and the second contact plug.
Abstract:
A method of manufacturing a memory device. A substrate having an active region, a plurality of gate structures and a plurality of source/drain regions are provided. An inter-layer dielectric layer is formed over the substrate. A global opening that exposes the source/drain regions for forming contacts and the gate structures inside the active region is formed in the inter-layer dielectric layer. A conductive layer that completely fills the global opening is formed over the substrate. A portion of the conductive layer and the inter-layer dielectric layer is removed to expose the upper surface of the gate structures, thereby forming a plurality of contacts between the gate structures.
Abstract:
A process for fabricating crown capacitors is described. A substrate having a template layer thereon is provided. A patterned support layer is formed over the template layer. A sacrifice layer is formed over the substrate covering the patterned support layer. Holes are formed through the sacrifice layer, the patterned support layer and the template layer, wherein the patterned support layer is located at a depth at which bowing of the sidewalls of the holes occurs and is bowed less than the sacrifice layer at the sidewalls. A substantially conformal conductive layer is formed over the substrate. The conductive layer is then divided into lower electrodes of the crown capacitors.
Abstract:
A method of piping defect detection is provided. A semiconductor substrate having an active region and an isolation region is provided, a plurality of semiconductor elements are formed on the semiconductor substrate, a dielectric layer is deposited on the semiconductor substrate and the semiconductor elements, and first and second contact plugs are formed in the dielectric layer to connect the active region and the isolation region respectively. The first contact plug and the second contact plug are illuminated by an electron beam, accumulating charge on the second contact plug, and piping defects are detected between the first contact plug and the second contact plug according to brightness contrast between the first contact plug and the second contact plug.
Abstract:
A structure of a probe is disclosed. The structure of the probe comprises a tube which comprises a larger end and a smaller end with a through hole disposed therewith, an axle having a supporting portion is positioned on the larger end of the tube, wherein the supporting portion comprises a fitting aperture, a pointed element fixed into the fitting aperture of the axle passes through the through hole of the tube, a positioning element positioned at a predetermined portion of the pointed element, a resilient element positioned around the axle, and a positioning cap comprising a through channel for fitting onto the axle and pressing against a juncture of the tube, wherein a smaller end of the positioning cap is formed as a positioning portion for positioning the resilient element. The pointed element is elastically slidable within the tube is used for probing.
Abstract:
A method of manufacturing semiconductor devices. A gate structure is formed over a substrate. A dopant implantation is carried out to form a lightly doped region in the substrate on each side of the gate structure. An insulation layer is formed over the substrate. A portion of the insulation is later removed so that a portion of the insulation layer is retained over the substrate on each side of the gate structure. A spacer is formed on each sidewall of the gate structure. Another ion implantation is carried out such that the dopants penetrate through the insulation layer on the substrate on each side of the gate structure to form a heavily doped region in the substrate.
Abstract:
A process for fabricating crown capacitors is described. A substrate having a template layer thereon is provided. A patterned support layer is formed over the template layer. A sacrifice layer is formed over the substrate covering the patterned support layer. Holes are formed through the sacrifice layer, the patterned support layer and the template layer, wherein the patterned support layer is located at a depth at which bowing of the sidewalls of the holes occurs and is bowed less than the sacrifice layer at the sidewalls. A substantially conformal conductive layer is formed over the substrate. The conductive layer is then divided into lower electrodes of the crown capacitors.
Abstract:
A three-piece golf putter comprises a putter head, an anti-shock slat, and a neck. The neck made of a material differs from that of the putter head and the anti-shock slat in specific gravity. So that, by replacing the neck with different specific gravity or different angle of elevation, the center of gravity may be adjusted to the best position to match with various striking postures. Moreover, by selecting the anti-shock slat in different specific gravities, depth of the center of gravity may be changed in order to enlarge region of the sweet spot for easy grasp.