公开(公告)号：US20090269686A1

公开(公告)日：2009-10-29

申请号：US12426600

申请日：2009-04-20

申请人： Kunie OGATA ,  Masahide TADOKORO ,  Tsuyoshi SHIBATA ,  Shinichi SHINOZUKA

发明人： Kunie OGATA ,  Masahide TADOKORO ,  Tsuyoshi SHIBATA ,  Shinichi SHINOZUKA

IPC分类号： G03C5/00 ,  G03B27/52

CPC分类号： G03F7/38 ,  H01L21/67225 ,  H01L21/67248

摘要： A processing temperature of thermal processing is corrected based on measurement of a first dimension of a resist pattern on a substrate from a previously obtained relation between a dimension of a resist pattern and a temperature of thermal processing, a second dimension of the resist pattern after thermal processing is performed at the corrected processing temperature is measured, a distribution within the substrate of the second dimension is classified into a linear component expressed by an approximated curved surface and a nonlinear component, a processing condition of exposure processing is corrected based on the linear component from a previously obtained relation between a dimension of a resist pattern and a processing condition of exposure processing, and thermal processing at the processing temperature corrected in a temperature correcting step and exposure processing under the processing condition corrected in an exposure condition correcting step are performed to form a predetermined pattern.

摘要翻译： 基于先前获得的抗蚀剂图案的尺寸和热处理温度之间的关系，基于热处理后的抗蚀剂图案的第二维度，基于基板上的抗蚀剂图案的第一尺寸的测量来校正热处理的处理温度 在校正后的处理温度下进行处理，将第二维度的基板内的分布分类成由近似曲面和非线性成分表示的线性分量，根据线性分量来校正曝光处理的处理条件 从先前获得的抗蚀剂图案的尺寸和曝光处理的处理条件之间的关系以及在温度校正步骤中校正的处理温度下的热处理和在曝光条件校正步骤中校正的处理条件下的曝光处理进行到 形成一个预先 确定模式。

公开(公告)号：US20080142508A1

公开(公告)日：2008-06-19

申请号：US11875239

申请日：2007-10-19

申请人： Megumi JYOUSAKA ,  Shinichi SHINOZUKA ,  Kunie OGATA

发明人： Megumi JYOUSAKA ,  Shinichi SHINOZUKA ,  Kunie OGATA

IPC分类号： H05B1/00 ,  G05D23/00 ,  G06F19/00

CPC分类号： G05D23/1931 ,  H01L21/67248

摘要： In the present invention, a thermal plate of a heating unit is divided into a plurality of thermal plate regions, and a temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting a temperature within the thermal plate can be set for each of the thermal plate regions of the thermal plate. The line widths within the substrate which has been subjected to a photolithography process are measured, and, from an in-plane tendency of the measured line widths, an in-plane tendency improvable by temperature correction and an unimprovable in-plane tendency are calculated using a Zernike polynomial. An average remaining tendency of the improvable in-plane tendency after improvement obtained in advance is added to the unimprovable in-plane tendency to estimate an in-plane tendency of the line widths within the substrate after change of temperature setting.

摘要翻译： 在本发明中，加热单元的热板被分成多个热板区域，并且可以为每个热板区域设定温度。 可以对热板的每个热板区域设定用于调节热板内的温度的温度校正值。 测量经过光刻工艺的衬底内的线宽，并且根据所测量的线宽的面内趋势，通过温度校正提高的面内趋势和不可估量的面内趋势，使用 一个Zernike多项式。 将预先获得的改进后的面内趋势的平均剩余趋势加到不可估量的平面内趋势中，以估计在温度设定变化之后衬底内线宽的面内趋势。

公开(公告)号：US20120279955A1

公开(公告)日：2012-11-08

申请号：US13551307

申请日：2012-07-17

申请人： Masahide TADOKORO ,  Ryoichi UEMURA ,  Mitsuteru YANO ,  Shinichi SHINOZUKA

发明人： Masahide TADOKORO ,  Ryoichi UEMURA ,  Mitsuteru YANO ,  Shinichi SHINOZUKA

IPC分类号： H05B1/02 ,  H05B3/68

CPC分类号： H05B1/0233 ,  H01L21/67248

摘要： In the present invention, temperature drop amounts of heating plate regions when the substrate is mounted on a heating plate are detected to detect a warped state of the substrate. From the temperature drop amounts of the heating plate regions, correction values for set temperatures of the heating plate regions are calculated. The calculation of the correction values for the set temperatures of the heating plate regions is performed by estimating steady temperatures within the substrate to be heat-processed on the heating plate from the temperature drop amounts of the heating plate regions using a correlation obtained in advance. From the estimated steady temperatures within the substrate and the temperature drop amounts of the heating regions, the correction values for the set temperatures of the heating plate regions are calculated. Based on the correction values for the set temperatures, the set temperatures of the heating plate regions are changed.

摘要翻译： 在本发明中，检测将基板安装在加热板上时的加热板区域的温度下降量，以检测基板的翘曲状态。 根据加热板区域的温度下降量，计算加热板区域的设定温度的校正值。 通过使用预先获得的相关性，从加热板区域的温度下降量估计加热板上的待加热基板内的稳定温度来进行加热板区域的设定温度的校正值的计算。 从估计的基板内的稳定温度和加热区域的温度下降量，计算加热板区域的设定温度的校正值。 基于设定温度的校正值，改变加热板区域的设定温度。