公开(公告)号：US06697257B1

公开(公告)日：2004-02-24

申请号：US09857802

申请日：2002-04-09

申请人： Kuno Wolf ,  Gerhard Koelle ,  Juergen Zaremba ,  Wolfgang Jacob ,  Alexander Wallrauch ,  Christoph Ruf ,  Ralf Schmid ,  Peter Urbach ,  Bernd Bireckoven ,  Hans-Reiner Krauss ,  Dirk Scholz

发明人： Kuno Wolf ,  Gerhard Koelle ,  Juergen Zaremba ,  Wolfgang Jacob ,  Alexander Wallrauch ,  Christoph Ruf ,  Ralf Schmid ,  Peter Urbach ,  Bernd Bireckoven ,  Hans-Reiner Krauss ,  Dirk Scholz

IPC分类号： H05K720

CPC分类号： H01L25/071 ,  H01L23/5385 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed in a power semiconductor module which includes a stack of carrier substrates, disposed one above the other in multiple layers and provided with at least one conductor track on at least one main surface, in which at least one electronic semiconductor component is disposed between two adjacent carrier substrates of the stack and is contacted electrically and heat-conductively to at least one conductor track of a carrier substrate disposed in the stack above the semiconductor component and to at least one further conductor track of a carrier substrate disposed in the stack below the semiconductor component. To both improve heat output and provide a compact design, the two outer carrier substrates of the stack are embodied as one upper and one lower housing wall of a closed housing part surrounding the at least one semiconductor component, and the interstices between the stacked carrier substrates are tightly closed by an encompassing wall secured to the carrier substrates.

摘要翻译： 公开在一种功率半导体模块中，该功率半导体模块包括一堆载体衬底，多个层叠在另一层之上并且在至少一个主表面上设置有至少一个导体轨道，其中至少一个电子半导体部件设置在两个相邻 并且对于布置在半导体部件上方的堆叠中的载体衬底的至少一个导体轨道和布置在半导体下面的堆叠中的载体衬底的至少一个另外的导体轨道，电性和热导电地接触 零件。 为了提高热输出并提供紧凑的设计，堆叠的两个外部载体衬底被实施为围绕至少一个半导体部件的封闭壳体部分的一个上部和一个下壳体壁，以及堆叠的载体衬底之间的间隙 被固定到载体基底的封闭壁紧密封闭。

公开(公告)号：US06727555B2

公开(公告)日：2004-04-27

申请号：US10199800

申请日：2002-07-19

申请人： Holger Heinisch ,  Rainer Topp ,  Wolfgang Jacob ,  Hans-Reiner Krauss

发明人： Holger Heinisch ,  Rainer Topp ,  Wolfgang Jacob ,  Hans-Reiner Krauss

IPC分类号： H01L2362

CPC分类号： H02H9/041 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13091 ,  H02H7/067 ,  H02H9/04 ,  H01L2924/00

摘要： A device for protecting electronic components against overvoltages of a supply voltage is provided, which device includes at least one semiconductor transistor which is switchable by a trigger circuit when a predetermined overvoltage value is reached, thereby converting electrical energy to thermal energy.

摘要翻译： 提供了一种用于保护电子部件以防止电源电压过压的装置，该装置包括至少一个半导体晶体管，当达到预定的过电压值时可由触发电路切换，从而将电能转换为热能。

公开(公告)号：US06538910B1

公开(公告)日：2003-03-25

申请号：US09914406

申请日：2002-05-14

申请人： Richard Spitz ,  Doerte Eimers-Klose ,  Hans-Reiner Krauss

发明人： Richard Spitz ,  Doerte Eimers-Klose ,  Hans-Reiner Krauss

IPC分类号： H02M706

CPC分类号： H02M7/062

摘要： A three-phase bridge rectifier system is proposed, having three rectifier paths, in which two rectifier elements at a time are in series, each rectifier path between the rectifier elements being connectible to one of three leads of a three-phase current terminal; the three cathode terminals of the rectifier elements lying opposite the three-phase current connection are connected to an positive pole, and the three anode terminals of the rectifier elements lying opposite the three-phase current connection are connected to a negative pole; at least three of the rectifier elements being formed by two-pole semiconductor rectifiers having at least two series-connected p-n junctions. The system is used for making available a volt motor vehicle electrical system having assured reliable voltage limitation.

摘要翻译： 提出了一种三相桥式整流器系统，其具有三个整流器路径，其中一次两个整流元件串联，整流元件之间的每个整流器路径可连接到三相电流端子的三个引线之一; 与三相电流连接相对的整流元件的三个阴极端子连接到正极，并且与三相电流连接相对的整流元件的三个阳极端子连接到负极; 至少三个整流元件由具有至少两个串联p-n结的两极半导体整流器形成。 该系统用于提供具有可靠的电压限制的伏特机动车辆电气系统。