公开(公告)号：US07030018B2

公开(公告)日：2006-04-18

申请号：US10358101

申请日：2003-02-04

申请人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC分类号： H01L21/302

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.

公开(公告)号：US08831767B2

公开(公告)日：2014-09-09

申请号：US13219607

申请日：2011-08-27

申请人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC分类号： G06F19/00 ,  B24B37/013 ,  B24B49/10 ,  B24B41/04 ,  B24B49/12 ,  B24B49/04 ,  B24B37/04

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.

摘要翻译： 提供了用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。 一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还包括确定输出信号是否在输出信号的范围之外。 超出范围的输出信号可能表示测量设备的参数失控。 在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。 另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。 该方法还包括从输出信号确定抛光垫的特性。

公开(公告)号：US06935922B2

公开(公告)日：2005-08-30

申请号：US10358106

申请日：2003-02-04

申请人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC分类号： B24B37/04 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12 ,  B24D49/00

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing are provided. One method includes scanning a specimen with a measurement device during polishing to generate output signals at measurement spots on the specimen. The method may also include determining a characteristic of polishing at the measurement spots from the output signals. In addition, the method may include determining relative or absolute locations of the measurement spots on the specimen. The method may further include generating a two-dimensional map of the characteristic at the relative or absolute locations of the measurement spots on the specimen. In some embodiments, the relative locations of the measurement spots may be determined from a representative scan path of the measurement device and an average spacing between starting points on individual scans.

摘要翻译： 提供了用于在抛光期间在样本上的测量点的相对或绝对位置处产生特征的二维图的方法和系统。 一种方法包括在抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还可以包括从输出信号确定测量点处的抛光特性。 此外，该方法可以包括确定样本上的测量点的相对或绝对位置。 该方法还可以包括在样本上的测量点的相对或绝对位置处生成特征的二维图。 在一些实施例中，测量点的相对位置可以从测量装置的代表性扫描路径和单个扫描上的起始点之间的平均间隔来确定。

公开(公告)号：US08010222B2

公开(公告)日：2011-08-30

申请号：US12032112

申请日：2008-02-15

申请人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC分类号： G06F19/00

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.

摘要翻译： 提供了用于在抛光期间监测测量装置的参数的方法和系统，抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。 一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还包括确定输出信号是否在输出信号的范围之外。 超出范围的输出信号可能表示测量设备的参数失控。 在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。 另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。 该方法还包括从输出信号确定抛光垫的特性。

公开(公告)号：US20080207089A1

公开(公告)日：2008-08-28

申请号：US12032112

申请日：2008-02-15

申请人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC分类号： B24B49/12

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.

摘要翻译： 提供了用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。 一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还包括确定输出信号是否在输出信号的范围之外。 超出范围的输出信号可能表示测量设备的参数失控。 在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。 另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。 该方法还包括从输出信号确定抛光垫的特性。

公开(公告)号：US07175503B2

公开(公告)日：2007-02-13

申请号：US10358069

申请日：2003-02-04

申请人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC分类号： B24B49/00 ,  B24B51/00

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Systems and methods for characterizing polishing of a specimen are provided. One method includes scanning a specimen with an eddy current device during polishing to generate output signals at measurement spots across the specimen. The method also includes combining a portion of the output signals generated at the measurement spots located within a zone on the specimen. In addition, the method includes determining a characteristic of polishing within the zone from the combined portion of the output signals. In some instances, a zone may include a predetermined range of radial and azimuthal positions on the specimen. In one embodiment, the method may include determining a characteristic of polishing within more than one zone on the specimen. Some embodiments may include determining an additional characteristic of polishing from the characteristic of polishing within more than one zone on the specimen.

摘要翻译： 提供了用于表征样品抛光的系统和方法。 一种方法包括在抛光过程中用涡流装置扫描样品，以在样品上的测量点产生输出信号。 该方法还包括组合在位于样品上的区域内的测量点处产生的输出信号的一部分。 此外，该方法包括从输出信号的组合部分确定该区域内的抛光特性。 在一些情况下，区域可以包括样品上的径向和方位位置的预定范围。 在一个实施例中，该方法可以包括确定在样本上的多于一个区域内的抛光的特性。 一些实施例可以包括从样品上的多于一个区域内的抛光特性确定抛光的附加特性。

公开(公告)号：US07052369B2

公开(公告)日：2006-05-30

申请号：US10358104

申请日：2003-02-04

申请人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC分类号： B24B49/00

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Systems and methods for detecting a presence of blobs on a specimen are provided. One method may include scanning measurement spots across a specimen during polishing of the specimen. The method may also include determining if the blobs are present on the specimen at the measurement spots. Each of the blobs may include unwanted material disposed upon a contiguous portion of the measurement spots. In some instances, the blobs may include copper. In some embodiments, scanning the measurement spots may include measuring an optical property and/or an electrical property of the specimen at the measurement spots. Another embodiment includes dynamically determining a signal threshold distinguishing a presence of the blobs from an absence of the blobs. An additional embodiment includes determining an endpoint of polishing if, for example, blobs are not determined to be present on the specimen.

公开(公告)号：US06884146B2

公开(公告)日：2005-04-26

申请号：US10358105

申请日：2003-02-04

申请人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC分类号： B24B37/04 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12 ,  B24D49/00

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Systems and methods for characterizing a polishing process are provided. One method includes scanning a specimen with two or more measurement devices during polishing. In one embodiment, the two or more measurement devices may include a reflectometer and a capacitance probe. In another embodiment, the two or more measurement devices may include an optical device and an eddy current device. An additional embodiment relates to a measurement device for scanning a specimen during polishing. The device includes a light source and a scanning assembly. The scanning assembly is configured to scan light from the light source across the specimen during polishing. Another measurement device includes a laser light source coupled to a first fiber optic bundle and a detector coupled to a second fiber optic bundle. An additional method includes scanning a specimen with different measurement devices during different steps of a polishing process.

摘要翻译： 提供了表征抛光工艺的系统和方法。 一种方法包括在抛光期间用两个或更多个测量装置扫描样品。 在一个实施例中，两个或更多个测量装置可以包括反射计和电容探针。 在另一个实施例中，两个或更多个测量装置可以包括光学装置和涡流装置。 另外的实施例涉及用于在抛光期间扫描试样的测量装置。 该装置包括光源和扫描组件。 扫描组件被配置为在抛光期间扫描来自光源的光穿过样品。 另一测量装置包括耦合到第一光纤束的激光光源和耦合到第二光纤束的检测器。 另外的方法包括在抛光过程的不同步骤期间用不同的测量装置扫描试样。

公开(公告)号：US20110313558A1

公开(公告)日：2011-12-22

申请号：US13219607

申请日：2011-08-27

申请人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC分类号： G06F19/00

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.

摘要翻译： 提供了用于在抛光期间监测测量装置的参数的方法和系统，抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。 一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还包括确定输出信号是否在输出信号的范围之外。 超出范围的输出信号可能表示测量设备的参数失控。 在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。 另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。 该方法还包括从输出信号确定抛光垫的特性。

公开(公告)号：US07332438B2

公开(公告)日：2008-02-19

申请号：US11353899

申请日：2006-02-14

申请人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC分类号： H01L21/302

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.

摘要翻译： 提供了用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。 一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还包括确定输出信号是否在输出信号的范围之外。 超出范围的输出信号可能表示测量设备的参数失控。 在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。 另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。 该方法还包括从输出信号确定抛光垫的特性。