公开(公告)号：US09022714B2

公开(公告)日：2015-05-05

申请号：US13141055

申请日：2010-01-12

申请人： Kyoo Hwan Lee ,  Duck Won Moon ,  Jae Wook Choi

发明人： Kyoo Hwan Lee ,  Duck Won Moon ,  Jae Wook Choi

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67742 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67748 ,  Y10S414/135 ,  Y10S414/139 ,  Y10S901/14 ,  Y10S901/19 ,  Y10S901/25

摘要： A substrate processing system and substrate transferring method capable of transferring a substrate bi-directionally through the use of substrate transferring device provided between two rows of processing chambers arranged linearly, thereby improving the substrate-transferring efficiency, the substrate processing system includes a transfer chamber having at least one bi-directional substrate transferring device for bi-directionally transferring a substrate; and a plurality of processing chambers for applying a semiconductor-manufacturing process to the substrate, wherein the plurality of processing chambers are linearly arranged along two rows confronting each other, and the transfer chamber is interposed between the two rows of the processing chambers, wherein the bi-directional substrate transferring device have a moving unit inside the transfer chamber, and horizontally moved by a linear motor; and a bi-directional substrate transferring unit in the moving unit, the bi-directional substrate transferring unit transferring the substrate to the processing chamber through a bi-directional sliding movement.

摘要翻译： 一种基板处理系统和基板转印方法，其能够通过使用设置在线性布置的两行处理室之间的基板转印装置双向转印基板，从而提高基板转印效率，所述基板处理系统包括：转印室，具有 至少一个用于双向转印衬底的双向衬底转移装置; 以及多个处理室，用于对基板施加半导体制造工艺，其中所述多个处理室沿着彼此面对的两列线性排列，并且所述传送室插入在所述两行处理室之间，其中， 双向基板转印装置在传送室内具有移动单元，并通过线性电动机水平移动; 以及移动单元中的双向基板传送单元，双向基板传送单元通过双向滑动运动将基板传送到处理室。

公开(公告)号：US20110262252A1

公开(公告)日：2011-10-27

申请号：US13141055

申请日：2010-01-12

申请人： Kyoo Hwan Lee ,  Duck Won Moon ,  Jae Wook Choi

发明人： Kyoo Hwan Lee ,  Duck Won Moon ,  Jae Wook Choi

IPC分类号： H01L21/677

CPC分类号： H01L21/67742 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67748 ,  Y10S414/135 ,  Y10S414/139 ,  Y10S901/14 ,  Y10S901/19 ,  Y10S901/25

摘要： A substrate processing system and substrate transferring method is disclosed, which is capable of transferring a substrate bi-directionally through the use of substrate transferring device provided between two rows of processing chambers arranged linearly, thereby improving the substrate-transferring efficiency, the substrate processing system comprising a transfer chamber having at least one bi-directional substrate transferring device for bi-directionally transferring a substrate; and a plurality of processing chambers for applying a semiconductor-manufacturing process to the substrate, wherein the plurality of processing chambers are linearly arranged along two rows confronting each other, and the transfer chamber is interposed between the two rows of the processing chambers, wherein the at least one bi-directional substrate transferring device comprises a moving unit provided inside the transfer chamber, and horizontally moved by a linear motor; and a bi-directional substrate transferring unit provided in the moving unit, the bi-directional substrate transferring unit for transferring the substrate to the processing chamber through a bi-directional sliding movement.

摘要翻译： 公开了一种基板处理系统和基板转印方法，其能够通过使用设置在线性布置的两行处理室之间的基板转印装置双向转印基板，从而提高基板转印效率，基板处理系统 包括具有用于双向转印衬底的至少一个双向衬底转移装置的传送室; 以及多个处理室，用于对基板施加半导体制造工艺，其中所述多个处理室沿着彼此面对的两列线性排列，并且所述传送室插入在所述两行处理室之间，其中， 至少一个双向基板传送装置包括设置在传送室内部并由线性马达水平移动的移动单元; 以及设置在所述移动单元中的双向基板传送单元，所述双向基板传送单元用于通过双向滑动运动将所述基板传送到所述处理室。