专利检索 ap:("Kyoung Hwan KIM" OR "Taewoo KANG" OR "Byung Lyul PARK" OR "Hyungjun JEON") AND inv:"Taewoo KANG" 第 1 页

1.

发明申请
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE 有权

公开(公告)号：US20180076108A1

公开(公告)日：2018-03-15

申请号：US15481446

申请日：2017-04-06

申请人： Kyoung Hwan KIM , Taewoo KANG , Byung Lyul PARK , Hyungjun JEON

发明人： Kyoung Hwan KIM , Taewoo KANG , Byung Lyul PARK , Hyungjun JEON

IPC分类号： H01L23/31 , H01L21/56 , H01L21/48 , H01L21/66 , H01L23/544 , H01L21/683 , H01L23/00

CPC分类号： H01L23/3128 , H01L21/4846 , H01L21/561 , H01L21/563 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L22/32 , H01L23/544 , H01L24/97 , H01L25/065 , H01L2221/68345 , H01L2221/68359 , H01L2221/68381 , H01L2223/54426

摘要： A method of manufacturing a semiconductor package includes forming a preliminary package, on a supporting substrate, which includes a connection substrate, a semiconductor chip and a molding pattern on the connection substrate and the semiconductor chip, forming a buffer pattern on the molding pattern, and forming a carrier substrate, on the buffer pattern, which includes a first portion contacting the buffer pattern and a second portion contacting the molding pattern.