APPARATUS FOR MANUFACTURING SEMICONDUCTOR
    2.
    发明申请
    APPARATUS FOR MANUFACTURING SEMICONDUCTOR 审中-公开
    制造半导体的装置

    公开(公告)号:US20120129321A1

    公开(公告)日:2012-05-24

    申请号:US13361907

    申请日:2012-01-30

    IPC分类号: H01L21/20

    摘要: A semiconductor device manufacturing apparatus includes a chamber including a reaction space, a substrate disposing unit configured to dispose a substrate within the chamber, a first heating unit configured to optically heat the reaction space and disposed under the chamber, a second heating unit configured to heat the reaction space through resistive heating and disposed over the chamber, and a plasma generating unit configured to generate plasma in the reaction space. Since the apparatus generates the plasma using the plasma generating unit disposed over the chamber, the deposition process based on heating and the etch process based on the plasma can be simultaneously performed in one single chamber.

    摘要翻译: 一种半导体器件制造装置,包括:包括反应空间的腔室,被配置为在所述腔室内设置基板的基板设置单元,配置为对所述反应空间进行光学加热并设置在所述室下方的第一加热单元, 所述反应空间通过电阻加热并设置在所述室上,等离子体产生单元被配置为在所述反应空间中产生等离子体。 由于该装置使用设置在室上的等离子体产生单元来产生等离子体,所以基于加热的沉积工艺和基于等离子体的蚀刻工艺可以在一个单一的室中同时进行。

    APPARATUS FOR MANUFACTURING SEMICONDUCTOR
    3.
    发明申请
    APPARATUS FOR MANUFACTURING SEMICONDUCTOR 审中-公开
    制造半导体的装置

    公开(公告)号:US20100006539A1

    公开(公告)日:2010-01-14

    申请号:US12259257

    申请日:2008-10-27

    IPC分类号: H01L21/3065 C23C16/00

    摘要: A semiconductor device manufacturing apparatus includes a chamber including a reaction space, a substrate disposing unit configured to dispose a substrate within the chamber, a first heating unit configured to optically heat the reaction space and disposed under the chamber, a second heating unit configured to heat the reaction space through resistive heating and disposed over the chamber, and a plasma generating unit configured to generate plasma in the reaction space. Since the apparatus generates the plasma using the plasma generating unit disposed over the chamber, the deposition process based on heating and the etch process based on the plasma can be simultaneously performed in one single chamber.

    摘要翻译: 一种半导体器件制造装置,包括:包括反应空间的腔室,被配置为在所述腔室内设置基板的基板设置单元,配置为对所述反应空间进行光学加热并设置在所述室下方的第一加热单元, 所述反应空间通过电阻加热并设置在所述室上,等离子体产生单元被配置为在所述反应空间中产生等离子体。 由于该装置使用设置在室上的等离子体产生单元来产生等离子体,所以基于加热的沉积工艺和基于等离子体的蚀刻工艺可以在一个单一的室中同时进行。

    METHOD OF FABRICATING TRANSISTOR
    4.
    发明申请
    METHOD OF FABRICATING TRANSISTOR 有权
    制造晶体管的方法

    公开(公告)号:US20110212604A1

    公开(公告)日:2011-09-01

    申请号:US13107789

    申请日:2011-05-13

    IPC分类号: H01L21/20

    摘要: A method of fabricating a transistor is provided. The transistor includes a SiGe epitaxial layer formed in a recess region of a substrate at both side of a gate electrode and a SiGe capping layer formed on the SiGe epitaxial layer. The transistor further includes a SiGe seed layer formed under the SiGe epitaxial layer and a silicon capping layer formed on the SiGe capping layer.

    摘要翻译: 提供一种制造晶体管的方法。 晶体管包括形成在栅电极两侧的衬底的凹陷区域中的SiGe外延层和形成在SiGe外延层上的SiGe覆盖层。 晶体管还包括形成在SiGe外延层下面的SiGe种子层和形成在SiGe覆盖层上的硅覆盖层。

    TRANSISTOR AND METHOD OF FABRICATING THE SAME
    5.
    发明申请
    TRANSISTOR AND METHOD OF FABRICATING THE SAME 有权
    晶体管及其制造方法

    公开(公告)号:US20090108308A1

    公开(公告)日:2009-04-30

    申请号:US12259081

    申请日:2008-10-27

    IPC分类号: H01L29/78 H01L21/336

    摘要: A transistor and a method of fabricating the same are provided. The transistor includes a SiGe epitaxial layer formed in a recess region of a substrate at both side of a gate electrode and a SiGe capping layer formed on the SiGe epitaxial layer. The transistor further includes a SiGe seed layer formed under the SiGe epitaxial layer and a silicon capping layer formed on the SiGe capping layer.

    摘要翻译: 提供一种晶体管及其制造方法。 晶体管包括形成在栅电极两侧的衬底的凹陷区域中的SiGe外延层和形成在SiGe外延层上的SiGe覆盖层。 晶体管还包括形成在SiGe外延层下面的SiGe种子层和形成在SiGe覆盖层上的硅覆盖层。