公开(公告)号：US09253925B1

公开(公告)日：2016-02-02

申请号：US13739995

申请日：2013-01-11

申请人： L-3 Communications Corp.

发明人： Robert H. Smith

IPC分类号： H05K7/20 ,  H02B1/01

CPC分类号： H05K7/20409 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/01 ,  H01L2224/32225 ,  H05K1/0209 ,  H05K7/20509 ,  H05K2201/066

摘要： An electronic assembly can include a support structure, a circuit substrate coupled to a first portion of the support structure, and a composite material panel coupled to a second portion of the support structure. An electronic device can be coupled to a mounting surface of the circuit substrate and disposed within a space enclosed by walls of the support structure. The panel can include contiguous sections inner surfaces of which can be oriented within twenty-five degrees of parallel to said mounting surface. Each section can be significantly more thermally conductive generally parallel to the inner surface of the section than generally perpendicular to the inner surface.

摘要翻译： 电子组件可以包括支撑结构，耦合到支撑结构的第一部分的电路基板以及耦合到支撑结构的第二部分的复合材料板。 电子设备可以耦合到电路基板的安装表面并且设置在由支撑结构的壁围绕的空间内。 面板可以包括连续部分，其内表面可以定向在平行于所述安装表面的二十五度内。 每个部分通常可大致平行于该部分的内表面导热，而不是大致垂直于内表面。