公开(公告)号：US10725485B2

公开(公告)日：2020-07-28

申请号：US15824447

申请日：2017-11-28

Applicant: LAM RESEARCH CORPORATION

Inventor： David Joseph Wetzel ,  Alexander Bleakie ,  Jacob Frederick Theisen

IPC: G05D23/24 ,  G05D23/19 ,  G01K13/02 ,  H04L21/00 ,  G01K7/42 ,  G01R21/14 ,  G01R21/127

Abstract: A temperature controller for a substrate support in a substrate processing system includes a power parameter module configured to calculate a power parameter indicative of power supplied to the substrate support. A coolant temperature parameter module configured to calculate a coolant temperature parameter indicative of a temperature of a coolant supplied to the substrate support. A heat transfer gas parameter module is configured to calculate a heat transfer gas parameter indicative of flow rates of a heat transfer gas supplied to the substrate support. A temperature calculation module is configured to calculate a temperature of the substrate support using the power parameter, the coolant temperature parameter, and the heat transfer gas parameter.