公开(公告)号：US20220186354A1

公开(公告)日：2022-06-16

申请号：US17600031

申请日：2020-04-13

Applicant: Lam Research Corporation

Inventor： Ann ERICKSON ,  John DAUGHERTY ,  Robin KOSHY

IPC: C23C4/11 ,  C23C28/04 ,  C25D11/18 ,  C23C16/455 ,  C23C16/44

Abstract: A component for use as part of a plasma processing chamber is provided. The component has a component body adapted for use as part of a plasma processing chamber. A first ceramic coating of a ceramic material is on a surface of the component body, wherein the first ceramic coating has a first side adjacent to the component body and a second side spaced apart from the component body and wherein the first ceramic coating has a porosity and density. A second ceramic coating of the ceramic material is on the second side of the first ceramic coating, wherein the second ceramic coating has a porosity that is less than the porosity of the first ceramic coating and the second ceramic coating has a density that is greater than the density of the first ceramic coating.

公开(公告)号：US20220285136A1

公开(公告)日：2022-09-08

申请号：US17631984

申请日：2020-07-30

Applicant: LAM RESEARCH CORPORATION

Inventor： Hui Ling HAN ,  Xinwei HUANG ,  Alexander Miller PATERSON ,  Saravanapriyan SRIRAMAN ,  Ann ERICKSON ,  Joanna WU ,  Seetharaman RAMACHANDRAN ,  Christopher KIMBALL ,  Aris PEREZ

IPC: H01J37/32 ,  H01L21/687

Abstract: An edge ring system for a substrate processing system includes a top edge ring including an annular body having an inner diameter and an outer diameter. The outer diameter of the top edge ring is smaller than a horizontal opening of a substrate port of the substrate processing system. A first edge ring is arranged below the top edge ring including an annular body having an inner diameter and an outer diameter. The outer diameter of the first edge ring is larger than the substrate port of the substrate processing system. The inner diameter of the first edge ring is smaller than the inner diameter of the top edge ring.

公开(公告)号：US20220139681A1

公开(公告)日：2022-05-05

申请号：US17435340

申请日：2020-03-04

Applicant: Lam Research Corporation

Inventor： Ann ERICKSON ,  Darrell EHRLICH

IPC: H01J37/32 ,  H01L21/683

Abstract: An electrostatic chuck system for a plasma processing chamber is provided. A base plate comprising Al—SiC is provided. A ceramic plate is disposed over the base plate. A bonding layer bonds the ceramic plate to the base plate.

公开(公告)号：US20220380894A1

公开(公告)日：2022-12-01

申请号：US17880855

申请日：2022-08-04

Applicant: LAM RESEARCH CORPORATION

Inventor： Keith GAFF ,  Devin RAMDUTT ,  Ann ERICKSON

IPC: C23C16/44 ,  H01L21/67 ,  H01L21/687 ,  C23C16/505 ,  C23C16/46

Abstract: A method is provided and includes: determining a temperature distribution pattern across a substrate or a support plate of a substrate support; determining, based on the temperature distribution pattern, a number of masks to apply to a top surface of the support plate, where the number of masks is greater than or equal to two; and determining patterns of the masks based on the temperature distribution pattern; and applying the masks over the top surface. The method further includes: performing a first machining process to remove a portion of the support plate unprotected by the masks to form first mesas and first recessed areas between the first mesas; removing a first mask from the support plate; performing a second machining process to form second recessed areas and at least one of second mesas or a first seal band area; and removing a second mask from the support plate.

公开(公告)号：US20220181127A1

公开(公告)日：2022-06-09

申请号：US17604956

申请日：2020-05-06

Applicant: Lam Research Corporation

Inventor： Ann ERICKSON ,  David Joseph WETZEL ,  Oleksandr MIKHNENKO ,  Seyedalireza TORBATISARRAF

IPC: H01J37/32 ,  H01L21/683

Abstract: An electrostatic chuck system is provided. A plate has gas apertures. A body formed by an additive process on a first side of the plate. The body has channels in fluid connection with the gas apertures, coolant channels, and support structure for supporting the gas channels and the coolant channels