公开(公告)号：US20250038011A1

公开(公告)日：2025-01-30

申请号：US18706772

申请日：2022-11-01

Applicant: LAM RESEARCH CORPORATION

Inventor： Richard H. GOULD ,  Karl Frederick LEESER ,  Michael NORDIN ,  Jose VELASCO

IPC: H01L21/67

Abstract: A substrate processing tool includes: a first processing module; a vacuum transfer module connected to the first processing module; one or more pumps; a backfill source; and one or more controllers. The one or more controllers are configured to: control the one or more pumps to reduce a chamber pressure in the vacuum transfer module from a first chamber pressure to a second chamber pressure and then backfill the vacuum transfer module with an inert gas to a third chamber pressure prior to permitting transfer of a substrate into the first processing module; subsequent to backfilling the vacuum transfer module, cause a transfer of the substrate from the vacuum transfer module to the first processing module; and cause the first processing module to process the substrate.