公开(公告)号：US3870196A

公开(公告)日：1975-03-11

申请号：US40194073

申请日：1973-09-28

申请人： LAURIER ASSOCIATES INC

发明人： HARGRAVES DON

IPC分类号： B28D5/00 ,  H01L21/301 ,  B26F3/00

CPC分类号： B28D5/0029 ,  B28D5/0052 ,  Y10T225/10 ,  Y10T225/371

摘要： A semiconductor wafer having crossing sets of parallel grooves in one face is broken into dice by placing the wafer with its scribed face down on a sheet of stretchable material to which the wafer adheres. A resilient mat is disposed under the stretchable sheet. A roller is moved over the upper face of the wafer and applies pressure along the grooves to break the wafer into strips. The sheet is then stretched to move the strips apart while keeping the scribed grooves in alignment. The roller then passes over the strips and applies pressure along the aligned scribed grooves which causes the strips to be broken into dice.

摘要翻译： 通过将晶片的划线面朝下放置在晶片附着的可拉伸材料片上，将具有一个面中的平行槽交叉组的半导体晶片分成多个骰子。 弹性垫设置在可拉伸片材的下方。 将辊子移动到晶片的上表面上并且沿着凹槽施加压力以将晶片破碎成条带。 然后将片材拉伸以使条带分开，同时保持划线槽对准。 然后，辊经过条带并沿着对准的划线槽施加压力，这导致条被破碎成骰子。