公开(公告)号：US3833486A

公开(公告)日：1974-09-03

申请号：US34504173

申请日：1973-03-26

Applicant: LEA RONAL INC

Inventor： NOBEL F ,  YOEN L

IPC: C25D3/02 ,  C25D3/38 ,  C23B5/02 ,  C23B5/18 ,  C23B5/46

CPC classification number: C25D3/02 ,  C25D3/38

Abstract: Improved cyanide-free aqueous electroplating baths for plating metals, the baths containing water soluble phosphonate chelating agents combined with at least one chelatable metal ion and containing as an additive at least one strong oxidizing agent, and electroplating processes employing said baths. Additional materials may also be added for further improvements.

Abstract translation: 用于电镀金属的改进的无氰化合物电镀浴，包含与至少一种螯合金属离子结合并含有至少一种强氧化剂的添加剂的水溶性膦酸盐螯合剂的浴和使用所述浴的电镀方法。 还可以添加另外的材料以进一步改进。