Cyanide-free electroplating
    4.
    发明授权
    Cyanide-free electroplating 失效
    无氰电镀

    公开(公告)号:US3833486A

    公开(公告)日:1974-09-03

    申请号:US34504173

    申请日:1973-03-26

    Applicant: LEA RONAL INC

    Inventor: NOBEL F YOEN L

    CPC classification number: C25D3/02 C25D3/38

    Abstract: Improved cyanide-free aqueous electroplating baths for plating metals, the baths containing water soluble phosphonate chelating agents combined with at least one chelatable metal ion and containing as an additive at least one strong oxidizing agent, and electroplating processes employing said baths. Additional materials may also be added for further improvements.

    Abstract translation: 用于电镀金属的改进的无氰化合物电镀浴,包含与至少一种螯合金属离子结合并含有至少一种强氧化剂的添加剂的水溶性膦酸盐螯合剂的浴和使用所述浴的电镀方法。 还可以添加另外的材料以进一步改进。

    Method of plating copper on aluminum
    5.
    发明授权
    Method of plating copper on aluminum 失效
    在铝上镀铜的方法

    公开(公告)号:US3775265A

    公开(公告)日:1973-11-27

    申请号:US3775265D

    申请日:1970-09-25

    Inventor: BHARUCHA N JANJUA M

    CPC classification number: C25D5/44 C25D3/38

    Abstract: Copper is electroplated directly onto aluminum by immersing an aluminum workpiece in an aqueous alkaline plating bath containing a divalent copper salt and an amine capable of complexing the copper, and passing an electric current through the plating bath using the workpiece as the cathode. The deposits which are obtained are strongly adherent and the method avoids the need for complicated mechanical or chemical pretreatment of the workpiece.

    Abstract translation: 通过将铝工件浸入含有二价铜盐和能够络合铜的胺的水性碱性电镀液中,并且使用工件作为阴极使电流通过电镀槽,将铜直接电镀在铝上。 获得的沉积物具有很强的粘附性,并且该方法避免了对工件进行复杂的机械或化学预处理的需要。

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