公开(公告)号：US20240057257A1

公开(公告)日：2024-02-15

申请号：US18231582

申请日：2023-08-08

Applicant: LEICA GEOSYSTEMS AG

Inventor： Ralph HARTI ,  Stefan KOHLGRÜBER ,  Andrey MARINOV ,  Michele PORTENTOSO

IPC: H05K1/18 ,  H05K1/02 ,  G01S17/894

CPC classification number: H05K1/181 ,  H05K1/0274 ,  G01S17/894 ,  H05K2201/10121

Abstract: A printed circuit board (PCB) having a lateral extent and comprising a side landing pad for direct bonding of an optoelectronic chip, whereby the side landing pad comprises at least two landing areas being differently oriented with regard to the lateral, thus enabling a bonding of the chip in at least two different lateral orientations relative to the printed circuit board, whereby the electrical connection lengths of the landing areas are equal, and an optoelectronic module based on such a printed circuit board and an according time of flight camera.