公开(公告)号：US20140147884A1

公开(公告)日：2014-05-29

申请号：US13873284

申请日：2013-04-30

Applicant: LEICA MICROSYSTEMS CMS GMBH

Inventor： Falk Schlaudraff ,  Christian Woditschka

IPC: G01N1/44

CPC classification number: G01N1/44 ,  G01N1/286 ,  G01N2001/2886

Abstract: A laser microdissection device includes a microscope stage for carrying a specimen to be cut, a laser light source for generating a laser beam and a microscope objective for focusing the laser beam onto the specimen. An optical laser scanning device is configured to deflect the laser beam so as to move the laser beam focus in an X-Y direction perpendicular to a main axis of the microscope objective. The laser microdissection device also includes at least one of a Z displacement device configured to move the microscope stage in a Z direction, or an optical focus shifting device configured to move the focus of the laser beam in the Z direction. The Z displacement device and/or optical focus shifting device are controllable, together with the optical laser scanning device, so as to move the laser beam focus in the specimen along a three-dimensional cut line in an X-Y-Z direction.

Abstract translation: 激光显微切割装置包括用于承载要切割的样品的显微镜载物台，用于产生激光束的激光源和用于将激光束聚焦到样本上的显微镜物镜。 光学激光扫描装置被配置为使激光束偏转，以使激光束聚焦沿与显微镜物镜的主轴垂直的X-Y方向移动。 激光显微切割装置还包括构造成在Z方向上移动显微镜载台的Z移位装置中的至少一个或被配置为沿Z方向移动激光束的焦点的光学移位装置中的至少一个。 Z位移装置和/或光学偏移装置与光学激光扫描装置一起是可控的，以沿着X-Y-Z方向的三维切割线移动样品中的激光束聚焦。