Cooling system and electronic apparatus

    公开(公告)号:US10681840B2

    公开(公告)日:2020-06-09

    申请号:US16022656

    申请日:2018-06-28

    IPC分类号: H05K7/20 G01K13/00

    摘要: The present invention aims to reduce noise derived from an operation sound of a fan while maintaining cooling capacity of the fan. A cooling system includes a fan which is disposed in a chassis in which a CPU which is exemplified as a heating element is housed, one temperature sensor which is disposed in the chassis, another temperature sensor which is disposed at a position which is different from a position of the one temperature sensor, and a fan control unit which drives the fan in a case where one temperature, which is based on a measured value of one temperature sensor, is at least a first threshold value or in a case where another temperature, which is based on a measured value of the other temperature sensor, is at least a second threshold value which is set to a value lower than the first threshold value.

    Electronic apparatus having illuminated key tops

    公开(公告)号:US11189444B2

    公开(公告)日:2021-11-30

    申请号:US17144738

    申请日:2021-01-08

    IPC分类号: H01H13/00 H01H13/83 F21V8/00

    摘要: An electronic apparatus having key tops that can be illuminated without cooling performance being affected is described. The electronic apparatus includes: a chassis and a keyboard device having a set of key tops; a base plate for supporting the key tops; a membrane sheet laminated on a top surface side of the base plate; a light guide plate laminated on a bottom surface side of the base plate; and a light source module for irradiating the key tops with light via the light guide plate. The keyboard device, which is located on a top surface side of the chassis, includes an inlet port for passing air in a top-bottom direction and a set of individual light sources arranged respectively on bottom surface sides of a part of the key tops that is located to overlap the inlet port.

    ELECTRONIC APPARATUS HAVING ILLUMINATED KEY TOPS

    公开(公告)号:US20210225603A1

    公开(公告)日:2021-07-22

    申请号:US17144738

    申请日:2021-01-08

    IPC分类号: H01H13/83 F21V8/00

    摘要: An electronic apparatus having key tops that can be illuminated without cooling performance being affected is described. The electronic apparatus includes: a chassis and a keyboard device having a set of key tops; a base plate for supporting the key tops; a membrane sheet laminated on a top surface side of the base plate; a light guide plate laminated on a bottom surface side of the base plate; and a light source module for irradiating the key tops with light via the light guide plate. The keyboard device, which is located on a top surface side of the chassis, includes an inlet port for passing air in a top-bottom direction and a set of individual light sources arranged respectively on bottom surface sides of a part of the key tops that is located to overlap the inlet port.

    Information processing apparatus and control method

    公开(公告)号:US11582882B2

    公开(公告)日:2023-02-14

    申请号:US17447467

    申请日:2021-09-13

    IPC分类号: H05K7/20 G06F1/20 G06F1/16

    摘要: An information processing apparatus includes: a first chassis having a first surface provided with at least an air intake port; a second chassis which is connected to the first chassis in a relatively rotatable manner and has a second surface that overlaps the first surface of the first chassis by the rotation; a heat dissipation unit having a fan for replacing air in the first chassis with outside air through at least the air intake port; a state detection unit that detects whether a state is a first state in which the first surface and the second surface overlap; and a control unit which changes control of the fan according to whether the state is the first state.

    Electronic apparatus with fan device

    公开(公告)号:US11269388B2

    公开(公告)日:2022-03-08

    申请号:US17074917

    申请日:2020-10-20

    IPC分类号: G06F1/20 H05K7/20

    摘要: An electronic apparatus includes: an apparatus chassis including therein an electronic board; a keyboard provided on a top of the apparatus chassis; and a fan device that includes a fan chassis and a blade part. The fan chassis includes a first air intake formed on a bottom surface thereof, a second air intake formed on a top surface thereof, and an air outlet formed on a side surface thereof. The blade part rotates inside the fan chassis. The fan device is arranged between a basal plate and a bottom surface of the keyboard inside the apparatus chassis. The basal plate includes a first inlet at a position overlapping the first air intake. The keyboard includes a second inlet that makes air pass through the keyboard in an up-down direction thereof. The electronic apparatus further includes a first water stop member that separates the first air intake from the electronic board.

    HEAT DISSIPATION MECHANISM FOR ELECTRONIC APPARATUSES

    公开(公告)号:US20210076537A1

    公开(公告)日:2021-03-11

    申请号:US17006218

    申请日:2020-08-28

    IPC分类号: H05K7/20

    摘要: A heat dissipation mechanism is provided. The heat dissipation mechanism includes a heat receiving plate and a heat transport member. The heat receiving plate includes a heat receiving surface surrounded by a recessed portion. The heat receiving surface is to be in contact with a heat transfer region of an electronic component in order to receive heat generated by the electronic component while the recessed portion receives at least one corner of the heat transfer region when viewed from a direction perpendicular to the heat receiving surface. The heat transport member transfers heat away from the heat receiving plate.

    INFORMATION PROCESSING APPARATUS AND CONTROL METHOD

    公开(公告)号:US20220174841A1

    公开(公告)日:2022-06-02

    申请号:US17447467

    申请日:2021-09-13

    IPC分类号: H05K7/20 G06F1/20 G06F1/16

    摘要: An information processing apparatus includes: a first chassis having a first surface provided with at least an air intake port; a second chassis which is connected to the first chassis in a relatively rotatable manner and has a second surface that overlaps the first surface of the first chassis by the rotation; a heat dissipation unit having a fan for replacing air in the first chassis with outside air through at least the air intake port; a state detection unit that detects whether a state is a first state in which the first surface and the second surface overlap; and a control unit which changes control of the fan according to whether the state is the first state.

    COOLING FOR ELECTRONIC EQUIPMENT
    9.
    发明申请
    COOLING FOR ELECTRONIC EQUIPMENT 有权
    冷却电子设备

    公开(公告)号:US20140185231A1

    公开(公告)日:2014-07-03

    申请号:US14140207

    申请日:2013-12-24

    IPC分类号: H05K7/20 G06F1/20 B23P19/00

    摘要: An embodiment provides an electronic device, including: a housing with an exhaust port and an intake port; a heat source contained in the housing; a heat transfer unit connected to the heat source; a first radiator located adjacent to the exhaust port, wherein the first radiator is connected to the heat transfer unit; a first blower fan, wherein the first blower fan discharges heat transmitted to the first radiator; and a second radiator located adjacent to the intake port, wherein the second radiator is connected to the heat transfer unit. Other embodiments are described and claimed.

    摘要翻译: 实施例提供一种电子设备,包括:具有排气口和进气口的壳体; 包含在壳体中的热源; 连接到热源的传热单元; 与排气口相邻的第一散热器,其中第一散热器连接到传热单元; 第一鼓风机,其中所述第一鼓风机排出传递到所述第一散热器的热量; 以及与所述进气口相邻的第二散热器,其中所述第二散热器连接到所述传热单元。 描述和要求保护其他实施例。

    HIGH CONDUCTANCE FIN
    10.
    发明申请

    公开(公告)号:US20220357114A1

    公开(公告)日:2022-11-10

    申请号:US17313425

    申请日:2021-05-06

    IPC分类号: F28F3/08 F28D15/02 B21D53/02

    摘要: A stacked conductance fin assembly, that is connected to a heatpipe and an exhaust fan of a computing device, includes: a plurality of fins that are partially overlapped and stacked in a linear array along a first axis of the stacked conductance fin assembly. Overlapping regions of the plurality of fins form two parallel structural walls along the first axis. The overlapping regions overlap along a second axis of the stacked conductance fin assembly, the second axis being perpendicular to the first axis. Each of the plurality of fins includes: a main surface that extends along the second axis between two outermost ends of the main surface; two walls that extend along the first axis, each wall extending from each of the outermost ends of the main surface, respectively; and two offset walls that extend along the first axis, each offset wall extending from each wall, respectively.