公开(公告)号：US10608156B2

公开(公告)日：2020-03-31

申请号：US15548061

申请日：2016-07-21

申请人： LG CHEM, LTD.

发明人： Dae-Ki Lee ,  Dong-Sik Kim ,  Ye-Rok Park ,  Jae-Ki Lee ,  Byung-Kyu Lim ,  Hyun-Woo Choi ,  Cheol-Hee Park ,  Seung-Hyup Lee

IPC分类号： H01L35/28 ,  H01L35/04 ,  H01L35/34 ,  H01L35/24 ,  H01L35/14 ,  H01L35/08 ,  H01L35/32 ,  H01L35/18

摘要： The present disclosure discloses a thermoelectric module to which a bonding technique for stably driving the thermoelectric module at high temperatures is applied and a method of manufacturing the thermoelectric module. The thermoelectric module according to the present disclosure includes thermoelectric elements including a thermoelectric semiconductor, an electrode which includes a metal material and is connected between the thermoelectric elements, and a bonding layer which is interposed between the thermoelectric element and the electrode to bond the thermoelectric element with the electrode and includes a metal compound including metals of two or more classes as a sintered body of a paste including metal powders of two or more classes.

公开(公告)号：US09490413B2

公开(公告)日：2016-11-08

申请号：US14437119

申请日：2014-09-18

申请人： LG CHEM, LTD.

发明人： Hyun-Woo Choi ,  Byung-Kyu Lim ,  Tae-Hoon Kim ,  Cheol-Hee Park ,  Eun-Ah You ,  O-Jong Kwon

IPC分类号： H01B1/02 ,  H01L35/16 ,  H01L35/20 ,  H01L31/0272 ,  H01L35/18 ,  H01L35/34 ,  C01B19/00

CPC分类号： H01L35/16 ,  C01B19/002 ,  C01B19/007 ,  C01P2006/32 ,  C01P2006/40 ,  H01L31/0272 ,  H01L31/02725 ,  H01L35/18 ,  H01L35/20 ,  H01L35/34

摘要： Disclosed is a new compound semiconductor material which may be used for thermoelectric material or the like, and its applications. The compound semiconductor may be represented by Chemical Formula 1 below: Chemical Formula 1 Bi2TexSea-xInyMz where, in Chemical Formula 1, M is at least one selected from the group consisting of Cu, Fe, Co, Ag and Ni, 2.5

摘要翻译： 公开了可用于热电材料等的新的化合物半导体材料及其应用。 化合物半导体可以由下述化学式1表示：化学式1 <化学式1> Bi2TexSea-xInyMz其中，在化学式1中，M为选自Cu，Fe，Co，Ag和Ni中的至少一种 ，2.5