公开(公告)号：US11257877B2

公开(公告)日：2022-02-22

申请号：US17095409

申请日：2020-11-11

Applicant: LG Display Co., Ltd.

Inventor： Sang Hyuk Won ,  Min Joo Kim ,  Jae Won Lee ,  Sang Hoon Pak ,  Byong Hoo Kim ,  Sang Heun Lee ,  Hyang Myoung Gwon ,  Jeong Hoon Lee

IPC: H01L27/32 ,  H01L51/52 ,  G06F3/041 ,  G06F3/044 ,  G09G3/3241

Abstract: Disclosed is a display device capable of reducing the thickness and the weigh thereof. In an organic light-emitting diode display device having a touch sensor, a plurality of routing lines, which are connected respectively to a plurality of touch sensors disposed on an encapsulation unit, are disposed on different planes so as to overlap each other and are electrically connected to each other through a plurality of routing contact holes. Thereby, a connection fault between the routing lines is prevented. In addition, through the provision of the touch sensors above the encapsulation unit, a separate attachment process is unnecessary, which results in a simplified manufacturing process and reduced costs.

公开(公告)号：US10892304B2

公开(公告)日：2021-01-12

申请号：US15966321

申请日：2018-04-30

Applicant: LG Display Co., Ltd.

Inventor： Sang Hyuk Won ,  Min Joo Kim ,  Jae Won Lee ,  Sang Hoon Pak ,  Byong Hoo Kim ,  Sang Heun Lee ,  Hyang Myoung Gwon ,  Jeong Hoon Lee

IPC: H01L27/32 ,  H01L51/52 ,  G06F3/041 ,  G06F3/044 ,  G09G3/3241

Abstract: Disclosed is a display device capable of reducing the thickness and the weigh thereof. In an organic light-emitting diode display device having a touch sensor, a plurality of routing lines, which are connected respectively to a plurality of touch sensors disposed on an encapsulation unit, are disposed on different planes so as to overlap each other and are electrically connected to each other through a plurality of routing contact holes. Thereby, a connection fault between the routing lines is prevented. In addition, through the provision of the touch sensors above the encapsulation unit, a separate attachment process is unnecessary, which results in a simplified manufacturing process and reduced costs.

公开(公告)号：US12289939B2

公开(公告)日：2025-04-29

申请号：US17536142

申请日：2021-11-29

Applicant: LG DISPLAY CO., LTD.

Inventor： Sang Hoon Pak ,  Tae Gyu Lee ,  Seon Hee Lee ,  Jung Eun Lee ,  Kyung Ha Lee

IPC: H10H29/14 ,  H10D30/67 ,  H10H20/821 ,  H10H20/831 ,  H10H20/84 ,  H10H20/851 ,  H10H20/855

Abstract: A display device includes first and second alignment electrodes disposed on a substrate, an alignment insulating film having a concave portion disposed between the first and second alignment electrodes, a light-emitting device disposed on the alignment insulating film, first and second electrodes electrically connected to the light-emitting device, a thin-film transistor connected to one of the first and second electrodes, and a plurality of insulating films providing a trench disposed on the concave portion, the trench having a larger width than the concave portion, thereby improving emission efficiency.

公开(公告)号：US11700759B2

公开(公告)日：2023-07-11

申请号：US17576452

申请日：2022-01-14

Applicant: LG DISPLAY CO., LTD.

Inventor： Sang Hyuk Won ,  Min Joo Kim ,  Jae Won Lee ,  Sang Hoon Pak ,  Byong Hoo Kim ,  Sang Heun Lee ,  Hyang Myoung Gwon ,  Jeong Hoon Lee

IPC: H10K59/40 ,  G06F3/041 ,  G06F3/044 ,  H10K59/38 ,  H10K59/131 ,  G09G3/3241 ,  H10K50/81 ,  H10K50/82

CPC classification number: H10K59/40 ,  G06F3/044 ,  G06F3/0412 ,  G06F3/0443 ,  G06F3/0446 ,  G09G3/3241 ,  H10K50/81 ,  H10K50/82 ,  H10K59/131 ,  H10K59/38 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112

Abstract: Disclosed is a display device capable of reducing the thickness and the weigh thereof. In an organic light-emitting diode display device having a touch sensor, a plurality of routing lines, which are connected respectively to a plurality of touch sensors disposed on an encapsulation unit, are disposed on different planes so as to overlap each other and are electrically connected to each other through a plurality of routing contact holes. Thereby, a connection fault between the routing lines is prevented. In addition, through the provision of the touch sensors above the encapsulation unit, a separate attachment process is unnecessary, which results in a simplified manufacturing process and reduced costs.