公开(公告)号：US20150144969A1

公开(公告)日：2015-05-28

申请号：US14277237

申请日：2014-05-14

Applicant: LG DISPLAY CO., LTD.

Inventor： SeungJoon LEE ,  DongHun LEE

IPC: H01L33/48 ,  H01L27/15

CPC classification number: H01L33/48 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  H01L27/153 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: A light emitting diode package, a light source module and a backlight unit including the same are provided. A plurality of light emitting diode packages are arranged on a printed circuit board without interference therebetween, by forming lines therein.

Abstract translation: 提供了发光二极管封装，光源模块和包括该发光二极管封装的背光单元。 多个发光二极管封装通过在其中形成线而布置在印刷电路板上而不产生干涉。