Method of fabricating array substrate

    公开(公告)号:US09640567B2

    公开(公告)日:2017-05-02

    申请号:US15040605

    申请日:2016-02-10

    Abstract: A method of fabrication an array substrate which includes foaming an oxide semiconductor layer on a substrate; forming a gate insulating layer corresponding to a central portion of the oxide semiconductor layer; forming a first reactive metallic pattern and second reactive metallic patterns on the gate insulating layer and portions of the oxide semiconductor layer exposed outside the gate insulating layer, respectively; forming a gate electrode on the first reactive metallic pattern; forming source and drain areas having conductive properties in the oxide semiconductor layer by performing heat treatment such that materials of the second reactive metallic patterns are diffused into the oxide semiconductor layer contacting the second reactive metallic patterns; forming an inter insulating layer on the gate electrode and having first contact holes that expose the second reactive metallic patterns; and forming source and drain electrodes on the inter insulating layer and contacting the second reactive metallic patterns through the first contact holes, respectively.

    Method of fabricating array substrate
    4.
    发明授权
    Method of fabricating array substrate 有权
    阵列基板的制作方法

    公开(公告)号:US09293478B2

    公开(公告)日:2016-03-22

    申请号:US14061563

    申请日:2013-10-23

    Abstract: A method of fabrication an array substrate includes forming an oxide semiconductor layer on a substrate; sequentially forming a gate insulating layer and a gate electrode corresponding to a central portion of the oxide semiconductor layer; forming source and drain areas having conductive properties in the oxide semiconductor layer by performing hydrogen plasma treatment; forming barrier layers on the source and drain areas, the barrier layer having a first thickness; forming an inter insulating layer on the gate electrode and having first contact holes that expose the barrier layers; and forming source and drain electrodes on the inter insulating layer and contacting the barrier layers through the first contact holes, respectively.

    Abstract translation: 制造阵列基板的方法包括在基板上形成氧化物半导体层; 顺序地形成对应于氧化物半导体层的中心部分的栅极绝缘层和栅电极; 通过进行氢等离子体处理在所述氧化物半导体层中形成具有导电性质的源区和漏区; 在源极和漏极区域上形成阻挡层,阻挡层具有第一厚度; 在所述栅电极上形成绝缘层,并具有暴露所述阻挡层的第一接触孔; 以及在所述绝缘层上形成源电极和漏电极,并且分别通过所述第一接触孔与所述阻挡层接触。

    Organic light-emitting display device and method of manufacturing the same

    公开(公告)号:US10361257B2

    公开(公告)日:2019-07-23

    申请号:US15794378

    申请日:2017-10-26

    Abstract: Disclosed are an organic light-emitting display device and a method of manufacturing the same. The organic light-emitting display device includes a thin-film transistor including source and drain electrodes, a first electrode formed by extending the source or drain electrode, a passivation layer and a bank insulation layer on the thin-film transistor configured to expose the first electrode so as to define an emission area, an organic light-emitting layer provided on the first electrode, and a second electrode configured to cover the organic light-emitting layer. The source or drain electrode includes a plurality of layers and the first electrode is integrally formed with any one layer portion of the source or drain electrode.

    Thin film transistor with oxide semiconductor having a portion with increased reflectance
    6.
    发明授权
    Thin film transistor with oxide semiconductor having a portion with increased reflectance 有权
    具有氧化物半导体的薄膜晶体管具有反射率增加的部分

    公开(公告)号:US09293603B2

    公开(公告)日:2016-03-22

    申请号:US14526832

    申请日:2014-10-29

    CPC classification number: H01L29/78696 H01L27/1225 H01L29/78648 H01L29/7869

    Abstract: An oxide thin film transistor (TFT) includes an oxide semiconductor layer including a first semiconductor layer and a second semiconductor layer on the first semiconductor layer; a gate insulating layer on the oxide semiconductor layer; a gate electrode on the gate insulating layer; an interlayer insulating layer on the gate electrode; and a source electrode and a drain electrode on the interlayer insulating layer and contacting the oxide semiconductor layer, wherein a first reflectance of the first semiconductor layer is greater than a second semiconductor layer.

    Abstract translation: 氧化物薄膜晶体管(TFT)包括在第一半导体层上包括第一半导体层和第二半导体层的氧化物半导体层; 氧化物半导体层上的栅极绝缘层; 栅绝缘层上的栅电极; 栅电极上的层间绝缘层; 以及在所述层间绝缘层上的与所述氧化物半导体层接触的源电极和漏电极,其中所述第一半导体层的第一反射率大于第二半导体层。

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