公开(公告)号：US20180019126A1

公开(公告)日：2018-01-18

申请号：US15640951

申请日：2017-07-03

Applicant: LG Display Co., Ltd.

Inventor： Jeong Kweon PARK ,  Jeong Joon LEE ,  Ju Ik HONG ,  Sang Chul LEE ,  Jangcheol KIM ,  Ik Hyun KUON ,  Tagyoung CHOI ,  Jinwook KWAK

IPC: H01L21/20 ,  H01L21/02 ,  B26F1/16 ,  H01L31/18 ,  B24B19/02

CPC classification number: H01L21/2007 ,  B24B19/02 ,  B26F1/16 ,  H01L21/02063 ,  H01L31/182

Abstract: Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.