公开(公告)号：US10276383B2

公开(公告)日：2019-04-30

申请号：US15640951

申请日：2017-07-03

Applicant: LG Display Co., Ltd.

Inventor： Jeong Kweon Park ,  Jeong Joon Lee ,  Ju Ik Hong ,  Sang Chul Lee ,  Jangcheol Kim ,  Ik Hyun Kuon ,  Tagyoung Choi ,  Jinwook Kwak

IPC: H01L21/20 ,  H01L31/18 ,  B24B19/02 ,  B26F1/16 ,  H01L21/02

Abstract: Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.

公开(公告)号：US10748771B2

公开(公告)日：2020-08-18

申请号：US16283392

申请日：2019-02-22

Applicant: LG Display Co., Ltd.

Inventor： Jeong Kweon Park ,  Jeong Joon Lee ,  Ju Ik Hong ,  Sang Chul Lee ,  Jangcheol Kim ,  Ik Hyun Kuon ,  Tagyoung Choi ,  Jinwook Kwak

IPC: H01L21/20 ,  H01L31/18 ,  H01L21/02 ,  B24B19/02 ,  B26F1/16

Abstract: Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.

公开(公告)号：US20190189448A1

公开(公告)日：2019-06-20

申请号：US16283392

申请日：2019-02-22

Applicant: LG Display Co., Ltd.

Inventor： Jeong Kweon PARK ,  Jeong Joon Lee ,  Ju Ik Hong ,  Sang Chul Lee ,  Jangcheol Kim ,  Ik Hyun Kuon ,  Tagyoung CHOI ,  Jinwook Kwak

IPC: H01L21/20 ,  H01L31/18 ,  H01L21/02 ,  B24B19/02 ,  B26F1/16

Abstract: Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.