公开(公告)号：US10700047B2

公开(公告)日：2020-06-30

申请号：US14867297

申请日：2015-09-28

Applicant: LG DISPLAY CO., LTD.

Inventor： Ju Ik Hong ,  Jeong Kweon Park ,  Sang Ryeon Park ,  Yong Soo Kim ,  Jang Cheol Kim ,  Ik Hyun Kuon

IPC: H01L25/16 ,  H01L27/12 ,  H01L25/00 ,  G02F1/1333 ,  G02F1/133 ,  G02F1/1339

Abstract: Disclosed are a display apparatus, where a component disposition area facing a component disposed on a lower end of a non-display area of a panel is removed in a lower substrate configuring the panel, and a method of manufacturing the same.

公开(公告)号：US10825837B2

公开(公告)日：2020-11-03

申请号：US15674288

申请日：2017-08-10

Applicant: LG DISPLAY CO., LTD.

Inventor： Ik Hyun Kuon ,  Jeong Kweon Park ,  Ju Ik Hong ,  Jangcheol Kim ,  Jinwook Kwak

IPC: B24D5/00 ,  H01L27/12 ,  H01L21/67 ,  B24B9/08 ,  H01L27/32 ,  H01L51/00

Abstract: Various embodiments provide a substrate processing apparatus for grinding a substrate, and a display device including a substrate in which a hole is formed in an edge of the substrate using the substrate processing apparatus. The substrate processing apparatus for processing a display substrate includes a body which, in operation, rotates, a cylindrical grinding part connected to the body, and a lateral groove formed in a surface of the cylindrical grinding part. The lateral groove is configured to accommodate the display substrate. Thus, it is possible to form a hole by grinding an edge of the display substrate so as to be matched with a designed value.

公开(公告)号：US10748771B2

公开(公告)日：2020-08-18

申请号：US16283392

申请日：2019-02-22

Applicant: LG Display Co., Ltd.

Inventor： Jeong Kweon Park ,  Jeong Joon Lee ,  Ju Ik Hong ,  Sang Chul Lee ,  Jangcheol Kim ,  Ik Hyun Kuon ,  Tagyoung Choi ,  Jinwook Kwak

IPC: H01L21/20 ,  H01L31/18 ,  H01L21/02 ,  B24B19/02 ,  B26F1/16

Abstract: Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.

公开(公告)号：US10276383B2

公开(公告)日：2019-04-30

申请号：US15640951

申请日：2017-07-03

Applicant: LG Display Co., Ltd.

Inventor： Jeong Kweon Park ,  Jeong Joon Lee ,  Ju Ik Hong ,  Sang Chul Lee ,  Jangcheol Kim ,  Ik Hyun Kuon ,  Tagyoung Choi ,  Jinwook Kwak

IPC: H01L21/20 ,  H01L31/18 ,  B24B19/02 ,  B26F1/16 ,  H01L21/02

Abstract: Disclosed herein is an apparatus for processing a substrate that forms a hole in a substrate while reducing a burr in the hole so that a module device can be inserted into the hole to reduce the thickness of a display device, and the display device using the apparatus. The apparatus for processing the substrate comprises a body configured to operably be rotatable, and a cylindrical cutting tip at an end of the body. The bottom surface of the cutting tip is in an acute angle with respect to a contact surface of the substrate to allow formation of a groove at the substrate.