Laminate and manufacturing method therefor

    公开(公告)号:US11152582B2

    公开(公告)日:2021-10-19

    申请号:US14909381

    申请日:2014-09-30

    摘要: The present application relates to a laminate and a method for preparing the same. The present application provides a laminate, including: a substrate; a first layer provided on the substrate; a second layer which is provided on the first layer and has an overhang structure with a width which is larger than that of the first layer; a conductive layer which is provided on the substrate and the second layer, in which the conductive layer provided on the substrate is electrically shorted from the conductive layer provided on the second layer.

    Method of manufacturing a conductive substrate

    公开(公告)号:US10111340B2

    公开(公告)日:2018-10-23

    申请号:US14909357

    申请日:2014-08-18

    摘要: Provided are a conducting substrate and a method for preparing the same. The method for preparing the conducting substrate according to an embodiment of the present application includes a) providing a substrate comprising a conducting layer; b) forming a metal layer on the entire surface of the substrate comprising the conducting layer; c) forming an insulating layer pattern on the metal layer; d) forming a metal layer pattern by over-etching the metal layer by using the insulating layer pattern as a mask; and e) reforming the insulating layer pattern.