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公开(公告)号:US11804585B2
公开(公告)日:2023-10-31
申请号:US17042867
申请日:2018-09-10
Applicant: LG ELECTRONICS INC.
Inventor: Bongseok Choi , Mingu Kang , Hooyoung Song
CPC classification number: H01L33/62 , F21S41/141 , F21S43/14 , H01L27/156 , H01L33/005 , H01L33/382 , H01L33/44 , H01L2933/0016 , H01L2933/0025 , H01L2933/0066
Abstract: Discussed is a lamp and a lamp device, and more particularly, to a lamp using a semiconductor light-emitting device, and a method of manufacturing the lamp. The lamp includes a substrate; a plurality of semiconductor light-emitting devices disposed on the substrate; a flat layer formed between the plurality of semiconductor light-emitting devices; a spacer disposed between the substrate and the flat layer; and an air gap disposed between each semiconductor light-emitting device and the spacer.
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公开(公告)号:US12300672B2
公开(公告)日:2025-05-13
申请号:US17616553
申请日:2019-06-12
Applicant: LG ELECTRONICS INC.
Inventor: Bongseok Choi
IPC: H01L25/00 , H01L25/075 , H10H20/01 , H10H20/857
Abstract: A method for manufacturing a display device can include growing a plurality of light emitting (LEDs) on a growing substrate; forming a member having a thermal flow characteristic on at least one side surface of each of the plurality of LEDs; separating each of the plurality of LEDs from the growing substrate; forming a plurality of assembly grooves in a wiring substrate for defining pixel regions; assembling the plurality of LEDs at locations respectively corresponding to the plurality of assembly grooves; and applying heat to the wiring substrate to perform a reflow process for adjusting a position of at least one of the plurality of LEDs.
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