公开(公告)号：US12243861B2

公开(公告)日：2025-03-04

申请号：US17770855

申请日：2019-10-22

Applicant: LG ELECTRONICS INC.

Inventor： Dohan Kim ,  Jeonghyo Kwon ,  Soohyun Kim ,  Indo Chung

IPC: H01L25/16 ,  H01L23/00 ,  H01L27/12

Abstract: The present disclosure provides a novel form of a display device which enables semiconductor light emitting elements having a vertical structure to be assembled onto a substrate and then wiring process to be performed stably without any change to the position of the elements during post-processing. The display device according to one embodiment of the present disclosure comprises: a substrate; a pair of assembly electrodes positioned on the substrate; a dielectric layer positioned on the assembly electrodes; a wiring electrode positioned on the dielectric layer and comprising a base electrode part and a low melting point junction; a partition wall which overlaps with a portion of the wiring electrode, is positioned on the dielectric layer, and defines an assembly groove to which a semiconductor light emitting element is assembled; and the vertical semiconductor light emitting element which is assembled in the assembly groove and is electrically connected to the low melting point junction of the wiring electrode, wherein the low melting point junction has a flow stop angle for controlling the thermal flow characteristic of the junction.

公开(公告)号：US12113161B2

公开(公告)日：2024-10-08

申请号：US17638444

申请日：2019-08-30

Applicant: LG ELECTRONICS INC.

Inventor： Indo Chung ,  Jeonghyo Kwon ,  Dohan Kim

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L33/005 ,  H01L33/382 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: The present specification provides a new type of a display device in which a wiring process is easily performed after a semiconductor light emitting element having a vertical structure is assembled on a substrate. Here, a semiconductor light emitting device according to an embodiment of the present invention is characterized by comprising: a substrate; a wiring electrode positioned on the substrate; a dielectric film positioned on the wiring electrode; an assembly electrode positioned on the dielectric film; an assembly insulating film positioned on the assembly electrode; a partition wall positioned on the assembly insulting film and defining an assembly groove to which a semiconductor light emitting element is assembled; and the semiconductor light emitting element which is assembled to the assembly groove and provided with conductive electrodes on both ends thereof, wherein the wiring electrode is provided with a protrusion portion, and the protrusion portion protrudes toward the assembly groove and is electrically connected to the conductive electrode on one end of the semiconductor light emitting element.