公开(公告)号：US09651241B2

公开(公告)日：2017-05-16

申请号：US14074953

申请日：2013-11-08

Applicant: LG ELECTRONICS INC.

Inventor： Hokyun Ju ,  Inhwan Ra ,  Kiwoong Park

IPC: F21V29/89 ,  F21V3/02 ,  F21V17/00 ,  F21V23/00 ,  F21V7/00 ,  F21V23/04 ,  F21V29/74 ,  F21V29/77 ,  F21K9/23

CPC classification number: F21V29/89 ,  F21K9/23 ,  F21V3/02 ,  F21V7/00 ,  F21V17/002 ,  F21V23/009 ,  F21V23/045 ,  F21V29/74 ,  F21V29/773

Abstract: Disclosed is a lighting apparatus which may include a heat sink, a light emitting device including a substrate mounted on the heat sink and LEDs arranged on the substrate, a bulb surrounding the light emitting device, an electronic module received within the heat sink to supply power to the light emitting device, a case provided to surround the electronic module, the case being configured to be inserted into the heat sink, a communication module separably coupled to the electronic module, and a power socket electrically connected to the electronic module, the power socket being mounted to the case. The communication module may include a housing, a circuit board provided in the housing. The circuit board may be electrically connected to the electronic module, and a wireless communication device may be provided on the circuit board.

公开(公告)号：US09039243B2

公开(公告)日：2015-05-26

申请号：US14292704

申请日：2014-05-30

Applicant: LG ELECTRONICS INC.

Inventor： Hokyun Ju ,  Inhwan Ra ,  Kiwoong Park

IPC: F21V29/00 ,  F21K99/00 ,  F21V3/02 ,  F21V17/00 ,  F21V23/00 ,  F21V7/00 ,  F21V23/04

CPC classification number: F21V29/89 ,  F21K9/23 ,  F21V3/02 ,  F21V7/00 ,  F21V17/002 ,  F21V23/009 ,  F21V23/045 ,  F21V29/74 ,  F21V29/773

Abstract: Disclosed is a lighting apparatus which may include a heat sink, a light emitting device including a substrate mounted on the heat sink and LEDs arranged on the substrate, a bulb surrounding the light emitting device, an electronic module received within the heat sink to supply power to the light emitting device, a case provided to surround the electronic module, the case being configured to be inserted into the heat sink, a communication module separably coupled to the electronic module, and a power socket electrically connected to the electronic module, the power socket being mounted to the case. The communication module may include a housing, a circuit board provided in the housing. The circuit board may be electrically connected to the electronic module, and a wireless communication device may be provided on the circuit board.

Abstract translation: 公开了一种照明装置，其可以包括散热器，包括安装在散热器上的基板和布置在基板上的LED的发光装置，围绕发光装置的灯泡，容纳在散热器内以供电的电子模块 发光装置，设置为围绕电子模块的壳体，壳体被配置为插入到散热器中，可分离地联接到电子模块的通信模块和电连接到电子模块的电源插座，电源 插座安装在外壳上。 通信模块可以包括壳体，设置在壳体中的电路板。 电路板可以电连接到电子模块，并且可以在电路板上提供无线通信设备。