公开(公告)号：US10359817B2

公开(公告)日：2019-07-23

申请号：US15499587

申请日：2017-04-27

申请人： LG ELECTRONICS INC.

发明人： Seunghyun Yun ,  Sangsoo Lee ,  Hyunseok Hwang ,  Jangil Lee ,  Kwangsik Yoo ,  Youngdon Choi ,  Seokmin Hong ,  Kihoon Nam ,  Woohyuk Choi ,  Inkeun Ryu

IPC分类号： G06F1/20 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H05K1/02 ,  G02F1/1333 ,  H05K7/20 ,  G06F1/16

摘要： A display device according to one embodiment of the present invention includes a display module, and a heat dissipation unit which is coupled to a rear side of the display module. The heat dissipation unit includes a core part including a plurality of hollow polygonal columns extending in a front/back direction, a front sheet which is coupled to a front portion of the core part, and a rear sheet which is coupled to a rear portion of the core part. The core part has a thickness of about 40% to about 60% in the front/back direction with respect to a total thickness of the heat dissipation unit in the front/back direction.

公开(公告)号：US09658659B2

公开(公告)日：2017-05-23

申请号：US14760435

申请日：2014-01-10

申请人： LG ELECTRONICS INC

发明人： Seunghyun Yun ,  Sangsoo Lee ,  Hyunseok Hwang ,  Jangil Lee ,  Kwangsik Yoo ,  Youngdon Choi ,  Seokmin Hong ,  Kihoon Nam ,  Woohyuk Choi ,  Inkeun Ryu

IPC分类号： G06F1/20 ,  H05K7/20 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H05K1/02 ,  G02F1/1333

CPC分类号： G06F1/20 ,  G02F1/133308 ,  G02F1/133382 ,  G02F2001/133314 ,  G06F1/1601 ,  H05K1/0203 ,  H05K5/0004 ,  H05K5/0017 ,  H05K5/02 ,  H05K5/03 ,  H05K7/20963

摘要： A display device according to one embodiment of the present invention includes a display module, and a heat dissipation unit which is coupled to a rear side of the display module. The heat dissipation unit includes a core part including a plurality of hollow polygonal columns extending in a front/back direction, a front sheet which is coupled to a front portion of the core part, and a rear sheet which is coupled to a rear portion of the core part. The core part has a thickness of about 40% to about 60% in the front/back direction with respect to a total thickness of the heat dissipation unit in the front/back direction.

公开(公告)号：US10733597B2

公开(公告)日：2020-08-04

申请号：US15487367

申请日：2017-04-13

申请人： LG ELECTRONICS INC.

发明人： Heekyung Woo ,  Seokmin Hong ,  Sanghyun Eim

IPC分类号： G06Q40/00 ,  G06Q20/34 ,  G06K19/07 ,  G06K19/073 ,  G06Q20/40

摘要： The present invention relates to a smart card including a sensor for sensing a finger touch and a controller for causing a first setting change by setting the smart card from a default payment method to a selected payment method, when a fingerprint of the user is recognized based on the finger touch sensed by the sensor; causing a second setting change by setting the smart card from the selected payment method to the default payment method when the fingerprint of the user and a fingerprint of a first person other than the user are simultaneously recognized and a first preset time elapses after completion of payment, and causing a third setting change by setting the smart card from the default payment method to the selected payment method when the fingerprint of the user and the fingerprint of the first person are simultaneously recognized again within a second preset time.